5SGXEA7H3F35C2L

The 5SGXEA7H3F35C2L is a Stratix V GX family FPGA in an FCBGA package, designed for high-density, programmable logic integration. It pairs a large logic capacity with significant on-chip memory and extensive I/O to support complex digital designs and high-pin-count system integration.

As a commercial-grade Stratix V GX device, its specifications include core supply requirements, operating temperature range, and packaging optimized for surface-mount assembly. Detailed electrical and switching characteristics are documented in the Stratix V device datasheet.

Key Features

• High Logic Density  Provides 622,000 logic elements for implementing large-scale digital designs and complex FPGA algorithms.
• Substantial Embedded Memory  Includes 51,200,000 total RAM bits (approximately 51.2 Mbits) of on-chip memory for buffers, FIFOs, and embedded data storage.
• Extensive I/O  Up to 552 device I/Os to support broad external interfacing and multi-channel connectivity.
• Package and Mounting  Surface-mount FCBGA package in a 1152-ball BBGA format; supplier device package listed as 1152-FBGA (35×35).
• Core Voltage Range  Core voltage supply specified between 820 mV and 880 mV for device operation.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for commercial-environment applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Leverage 622,000 logic elements and approximately 51.2 Mbits of embedded memory for complex logic, DSP functions, and algorithm acceleration.
• Multi-interface platforms  Use the 552 I/Os to integrate with multiple peripherals, sensors, and high-pin-count connectors.
• Board-level integration  FCBGA 1152-ball packaging and surface-mount mounting accommodate compact, high-performance PCB designs.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable scaling of logic-intensive designs without immediate need for additional devices.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and data processing.
• High I/O count: 552 I/Os simplify board routing for multi-channel systems and complex I/O configurations.
• Surface-mount FCBGA packaging: Compact 1152-ball FCBGA supports dense board layouts and reliable soldered connections for production assemblies.
• Clear commercial operating envelope: Specified 0 °C to 85 °C operating range and 820–880 mV core supply provide predictable integration parameters for commercial designs.
• RoHS compliant: Meets environmental requirements for lead-free and restricted-substance assembly processes.

Why Choose 5SGXEA7H3F35C2L?

The 5SGXEA7H3F35C2L delivers a combination of high logic capacity, ample embedded memory, and a large number of I/Os in a production-ready FCBGA package. Its specifications support complex, high-density FPGA designs where on-chip resources and I/O density are primary considerations. Engineers targeting commercial-grade systems that require scalable logic, substantial on-chip RAM, and robust packaging will find this Stratix V GX device aligns with those requirements.

Backed by the Stratix V device documentation, this FPGA is suitable for designs that demand clearly defined electrical characteristics and proven architecture-level information from the device family datasheet.

If you would like pricing, availability, or to submit a request for a quote for 5SGXEA7H3F35C2L, please request a quote or contact sales through your usual procurement channel.