5SGXEA7H2F35I3N

The 5SGXEA7H2F35I3N is an Intel Stratix V GX field programmable gate array delivering a high density of programmable logic, on-chip memory, and I/O in a 1152-ball FCBGA package. This industrial-grade FPGA is designed for systems that require large logic capacity, substantial embedded RAM, and extensive I/O connectivity while operating across a wide industrial temperature range.

Key value comes from its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/O pins, enabling complex, high-density designs in industrial applications.

Key Features

• Core Logic Density  Provides 622,000 logic elements suitable for large, complex digital designs and multi-function system integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support data buffering, FIFOs, and large on-chip state machines.
• I/O Capacity  552 user I/O pins to enable broad peripheral connectivity, board-level integration, and multi-channel interfaces.
• Package & Mounting  1152-ball FCBGA (35×35) package, surface-mountable for compact board designs that require high I/O density.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Supply Voltage  Core voltage range of 820 mV to 880 mV to match system power requirements and core supply design.
• RoHS Compliant  Manufactured in compliance with RoHS standards for lead-free assembly.
• Stratix V GX Series Transceiver Capability  As a Stratix V GX device, the family supports GX channel transceiver speed grades (series data shows GX channel capability up to 14.1 Gbps depending on speed grade).

Typical Applications

• Industrial Automation  Implement control, sequencing, and high-density I/O aggregation in equipment that must operate across industrial temperature ranges.
• High‑Density FPGA Designs  Consolidate multiple digital functions and large state machines into a single device using extensive logic and on-chip RAM.
• Board‑Level Integration  Use the 1152-ball FCBGA package and 552 I/O pins for dense board layouts requiring many interfaces and high pin counts.

Unique Advantages

• Large Logic Capacity: 622,000 logic elements enable consolidation of multiple functions and complex algorithms into a single FPGA.
• Substantial On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM reduces external memory needs and simplifies data path design.
• High I/O Count: 552 I/Os provide flexibility for interfacing with many peripherals and high pin-count system architectures.
• Industrial Reliability: Rated −40 °C to 100 °C and listed as industrial grade for deployment in demanding operational environments.
• Compact, Surface‑Mount Package: 1152-ball FCBGA (35×35) allows high-density, surface-mount PCB implementations while keeping board area optimized.
• Standards‑Aware Manufacturing: RoHS compliance supports lead‑free production requirements.

Why Choose 5SGXEA7H2F35I3N?

The 5SGXEA7H2F35I3N positions itself as a high-density, industrial-grade Stratix V GX FPGA that balances very large logic capacity, significant embedded memory, and extensive I/O in a compact FCBGA package. Its electrical and thermal ratings make it suitable for systems that demand robust operation across industrial temperature ranges while supporting complex integration on a single device.

This part is a practical choice for engineering teams building large-scale digital systems, high-density board-level solutions, or industrial control equipment that require substantial on-chip resources and high I/O availability. The combination of logic, embedded RAM, and package density offers scalability and longevity for designs that require a reliable, high-capacity FPGA building block.

Request a quote or submit an inquiry today to get pricing and availability for 5SGXEA7H2F35I3N and discuss how it can fit into your next high-density or industrial FPGA design.