5SGXEA7H2F35I3LN

The 5SGXEA7H2F35I3LN is an Intel Stratix V GX Field Programmable Gate Array (FPGA) in a 1152‑BBGA (35×35) FCBGA package designed for industrial applications. It delivers large programmable logic capacity, substantial on‑chip memory, and a high I/O count for complex system integration.

Built for high‑density, high‑I/O designs, this device targets applications that require extensive logic resources, embedded memory, and robust thermal range while operating from a low core voltage.

Key Features

• Core Logic  Provides 622,000 logic elements for implementing large-scale custom logic, signal processing, and control algorithms.
• Embedded Memory  Includes approximately 51.2 Mbits of embedded memory for buffers, FIFOs, and on‑chip data storage.
• I/O Capability  Up to 552 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power Supply  Core operating voltage range of 820 mV to 880 mV for compatibility with low‑voltage system architectures.
• Package & Mounting  1152‑BBGA FCBGA (supplier package: 1152‑FBGA 35×35) in a surface‑mount form factor suitable for dense PCB layouts.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Standards Compliance  RoHS‑compliant for environmental and regulatory conformance.

Typical Applications

• High‑density digital systems  Leverage the large logic element count and embedded memory to implement complex programmable datapaths and protocol engines.
• Network and communications equipment  Use the high I/O density to interface with multiple high‑speed lanes and peripheral modules.
• Data processing and acceleration  Employ on‑chip memory and extensive logic to create custom accelerators and preprocessing engines.
• Industrial control and instrumentation  Industrial temperature rating and robust packaging suit demanding embedded control and measurement systems.

Unique Advantages

• High programmable capacity: 622,000 logic elements enable large, complex designs without external logic expansion.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduce reliance on external memory and improve data throughput.
• Extensive I/O integration: 552 I/Os simplify board-level interfacing and reduce the need for additional I/O expansion devices.
• Industrial reliability: −40 °C to 100 °C operating range supports deployment in harsh or temperature‑variable environments.
• Compact, surface‑mount package: 1152‑BBGA (35×35) FCBGA provides a high‑density footprint for space-constrained PCBs.
• RoHS‑compliant: Meets common environmental directives for lead‑free assembly.

Why Choose 5SGXEA7H2F35I3LN?

The 5SGXEA7H2F35I3LN combines a large logic fabric, significant embedded memory, and a high I/O count in a compact industrial‑grade package, making it well suited for designers building complex, high‑throughput systems. Its low core voltage operation and RoHS compliance support modern low‑power architectures and regulatory requirements.

This device is appropriate for engineering teams who need scalable programmable resources and robust thermal performance for industrial and communications applications, while maintaining a compact PCB footprint.

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