5SGXEA7H2F35I3LG

The 5SGXEA7H2F35I3LG is a Stratix V GX FPGA in an industrial-grade configuration. It provides large on-chip logic and embedded memory capacity along with abundant I/O in a surface-mount FCBGA package for high-density system designs.

Designed for applications that require substantial programmable logic, plentiful I/O, and operation across an extended temperature range, this device delivers series-level Stratix V GX characteristics as documented in the product datasheet.

Key Features

• Core Logic  Approximately 622,000 logic elements for complex digital designs and high integration density.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, caches, and memory-intensive algorithms.
• I/O Capacity  552 I/O pins to support wide external interfacing and parallel connectivity requirements.
• Package & Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35x35). Surface mount construction for compact board integration.
• Power Supply  Specified operating core voltage range: 820 mV to 880 mV for defined power and timing behavior.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C and designated as Industrial grade.
• Stratix V GX Series Characteristics  Part of the Stratix V family (GX variant), which the datasheet identifies with series-level electrical and transceiver speed grades and device offerings.
• RoHS Compliance  RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating and robust logic/memory capacity support control systems and programmable automation controllers that require extended ambient operation.
• High-density Digital Processing  Large logic element count and substantial on-chip RAM enable complex signal processing, protocol handling, and custom compute engines.
• I/O-Intensive Systems  With 552 I/O pins, the device suits applications that require extensive parallel interfaces or multiple peripheral connections.
• Embedded Memory-Heavy Designs  Approximately 51.2 Mbits of embedded RAM provide on-chip storage for buffering, frame memory, and state machines in embedded systems.

Unique Advantages

• High Logic Capacity:  Approximately 622,000 logic elements let designers implement large, integrated FPGA designs without partitioning across multiple devices.
• Significant On-Chip Memory:  About 51.2 Mbits of embedded RAM reduces external memory dependence and simplifies board-level BOMs for memory-heavy functions.
• Extensive External Connectivity:  552 I/Os provide flexibility for mixed parallel and serial interfacing, sensor arrays, or wide data buses.
• Industrial Temperature Range:  Rated −40 °C to 100 °C for deployment in temperature-demanding environments where industrial-grade operation is required.
• Compact Surface-Mount Package:  1152-ball FCBGA packaging in a 1152-FBGA (35x35) supplier configuration enables dense PCB layouts while supporting high pin counts.
• Defined Core Voltage Range:  Specified 820 mV–880 mV supply window provides precise power planning for system integrators.

Why Choose 5SGXEA7H2F35I3LG?

The 5SGXEA7H2F35I3LG combines large programmable logic capacity, substantial embedded memory, and a high I/O count in an industrial-grade Stratix V GX device. Its specifications are targeted at systems that need on-chip resources and reliable operation across an extended temperature range.

This part is appropriate for design teams building high-density digital processing, I/O-rich systems, or industrial embedded solutions that demand a balance of logic, memory, and connectivity within a surface-mount FCBGA footprint.

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