5SGXEA7H2F35I2N

The 5SGXEA7H2F35I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) designed for high-density, high-I/O designs. It integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory with 552 user I/Os in a 1152-BBGA package.

Built for industrial applications, the device supports surface-mount assembly, RoHS compliance, and an extended operating temperature range from –40°C to 100°C, with a core voltage supply range of 870 mV to 930 mV.

Key Features

• Core Logic  622,000 logic elements provide large programmable logic capacity for complex designs and algorithm implementation.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, lookup tables, and on-chip data storage.
• I/O Density  552 general-purpose I/Os to support dense external interfacing and multi-channel designs.
• Package and Mounting  1152-BBGA (FCBGA) package; supplier device package specified as 1152-FBGA (35×35). Surface-mount mounting type.
• Power  Core voltage supply specified between 870 mV and 930 mV to align with system power-rail planning.
• Thermal and Environmental  Industrial-grade device with an operating temperature range of –40°C to 100°C and RoHS compliance for environmental standards.

Typical Applications

• High-density FPGA designs  Implement large-scale logic and complex algorithms using the device's 622,000 logic elements and embedded RAM.
• Industrial control and automation  Industrial-grade temperature range (–40°C to 100°C) and robust packaging support deployment in factory and process environments.
• Dense I/O systems  552 I/Os and a high-pin-count FBGA package enable integration with multi-channel sensor arrays, interfaces, and complex board-level routing.

Unique Advantages

• High logic capacity: 622,000 logic elements reduce the need for multi-device partitioning in large designs.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffers, state machines, and data-intensive processing on-chip.
• Extensive I/O connectivity: 552 I/Os facilitate high parallelism and flexible external interfacing without sacrificing package density.
• Industrial robustness: Rated for –40°C to 100°C operation, making it suitable for a wide range of industrial deployments.
• Compact, manufacturable package: 1152-BBGA (1152-FBGA supplier package, 35×35) supports surface-mount assembly and high-density PCB integration.
• Regulatory alignment: RoHS compliance supports environmental and supply-chain requirements.

Why Choose 5SGXEA7H2F35I2N?

The 5SGXEA7H2F35I2N delivers a combination of large programmable logic capacity, substantial embedded memory, and high I/O density in a manufacturable FBGA package. Its industrial operating range and RoHS compliance make it a practical choice for designs that demand reliability across challenging environments.

This Stratix V GX device is positioned for engineering teams that require scalable logic resources, extensive on-chip memory, and broad external connectivity—helping to simplify board-level integration and reduce system complexity while aligning with industrial temperature and environmental requirements.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXEA7H2F35I2N FPGA. Include your quantity and delivery needs to receive a tailored response.