5SGXEA7H2F35I2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 670 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7H2F35I2LG – Stratix® V GX FPGA, 1152-BBGA FCBGA
The 5SGXEA7H2F35I2LG is an Intel Stratix V GX field programmable gate array (FPGA) in a 1152-BBGA (35 × 35 mm) FCBGA package. It delivers high logic density and large embedded memory capacity in an industrial-grade FPGA footprint for applications that require substantial on-chip resources and many I/O signals.
This device is well suited for designs that need a combination of abundant programmable logic, significant on-chip RAM, and a high I/O count while operating across an industrial temperature range and a low core-voltage domain.
Key Features
- High Logic Density — 622,000 logic elements provide extensive programmable fabric for complex designs and large-scale logic integration.
- Fabric Resources — Approximately 51.2 Mbits of embedded memory (total RAM bits: 51,200,000) to support large buffering, lookup tables, and on-chip data storage.
- I/O Capacity & Package — 552 user I/O pins in a 1152-BBGA FCBGA package (supplier package: 1152-FBGA, 35×35 mm) to accommodate dense board-level connectivity.
- Industrial Grade — Rated for industrial operation with an operating temperature range of −40 °C to 100 °C, enabling deployment in harsh or temperature-variable environments.
- Low-Voltage Core — Core supply range of 820 mV to 880 mV for designs targeting lower core-voltage operation.
- Surface Mount — Surface-mount mounting type suitable for modern PCB assembly and automated manufacturing.
- RoHS Compliant — Device is RoHS compliant for environmental and regulatory alignment.
Typical Applications
- High-performance signal processing — Large logic and memory resources support dense DSP pipelines, data buffering, and on-chip algorithm implementation.
- Network and communications infrastructure — High I/O count and package density enable interfacing with multiple transceivers and line cards in networking equipment.
- Data acquisition and aggregation — Significant embedded RAM and logic enable aggregation, pre-processing, and temporary storage of high-channel-count sensor or IO data.
- Industrial control and automation — Industrial temperature rating and robust packaging suited for control systems, PLCs, and factory automation hardware.
Unique Advantages
- Large on-chip resources: 622,000 logic elements and approximately 51.2 Mbits of embedded memory reduce reliance on external components and simplify system architecture.
- High connectivity: 552 I/O pins in a compact 35 × 35 mm FCBGA footprint allow dense peripheral and board-level connections with a single device.
- Industrial robustness: −40 °C to 100 °C operating range supports deployment in temperature-variable and industrial environments.
- Low-voltage core operation: 820–880 mV supply range enables designs targeting lower core power consumption and modern voltage domains.
- RoHS compliant: Meets environmental compliance requirements for regulated markets and reduced hazardous substance concerns.
Why Choose 5SGXEA7H2F35I2LG?
This Stratix V GX FPGA combines high logic capacity, substantial embedded memory, and a large I/O count in a standardized 1152-BBGA FCBGA package. It is positioned for engineers and system designers who need a single, high-density programmable device to consolidate logic, buffering, and I/O interfacing in industrial applications.
With an industrial temperature rating, low core-voltage support, and RoHS compliance, the 5SGXEA7H2F35I2LG provides a scalable, reliable platform for medium- to large-scale FPGA designs where on-chip integration and board-level connectivity are priorities.
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