5SGXEA7H2F35I2G

The 5SGXEA7H2F35I2G is an Intel Stratix V GX Field Programmable Gate Array supplied in a 1152-ball BGA package. Designed for industrial-grade deployments, this device delivers a very high logic capacity and large embedded memory while supporting a wide array of I/O connections and a low-voltage core supply.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os, the 5SGXEA7H2F35I2G targets high-density digital integration and complex, I/O-intensive designs that require robust thermal and voltage operating margins.

Key Features

• Core Capacity  622,000 logic elements enable large-scale custom logic implementations and complex state machines.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local storage.
• I/O Density  552 user I/Os for high-pin-count interfaces and wide parallel connectivity.
• Package & Mounting  1152-BBGA / FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for board-level integration.
• Power Supply  Core voltage supply range of 870 mV to 930 mV to match targeted power architectures.
• Operating Temperature  Industrial temperature grade rated from –40 °C to 100 °C for extended environmental operation.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic integration  Implement large custom digital functions and complex state machines using the device's 622,000 logic elements and substantial on-chip RAM.
• I/O‑intensive systems  Use the 552 I/Os to interface with wide parallel buses, multi-channel front ends, or extensive sensor arrays.
• Industrial equipment  Deploy in equipment that requires industrial temperature operation (–40 °C to 100 °C) and surface-mount BGA packaging.

Unique Advantages

• Massive logic capacity: 622,000 logic elements provide headroom for complex, integrated digital functions without relying on multiple devices.
• Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependency and simplifies board designs.
• High I/O count: 552 user I/Os enable broad peripheral and bus connectivity on a single device footprint.
• Industrial temperature rating: Rated –40 °C to 100 °C to support systems that operate across wide thermal ranges.
• BGA packaging for dense assemblies: 1152-ball FCBGA (35×35) package optimized for compact, high-density PCB layouts.
• RoHS compliant: Meets lead-free and restricted substance requirements for modern manufacturing.

Why Choose 5SGXEA7H2F35I2G?

The 5SGXEA7H2F35I2G balances very high logic density, substantial embedded memory, and extensive I/O in an industrial-rated Stratix V GX FPGA. Its low-voltage core range and BGA packaging make it suitable for designs that demand integration, robust thermal headroom, and high pin counts on compact PCBs.

This device is ideal for engineering teams building large, I/O-rich digital systems that require on-chip memory and industrial environmental tolerance while maintaining a single-device implementation strategy.

Request a quote or submit an inquiry to obtain pricing, lead-time, and availability information for the 5SGXEA7H2F35I2G.