5SGXEA7H2F35C3N

The 5SGXEA7H2F35C3N is a Stratix V GX-family FPGA in a 1152-ball FCBGA package, offering high-density programmable logic for demanding digital designs. It integrates 622,000 logic elements and approximately 51.2 Mbits of embedded memory, making it suited for applications that require substantial on-chip logic and memory resources.

This commercial-grade device is designed for systems-level integration where high I/O count and dense logic enable complex signal processing, protocol handling, and system orchestration. The device datasheet documents electrical and switching characteristics, including transceiver and I/O timing details, to support design and validation.

Key Features

• High-density logic: 622,000 logic elements for implementing large-scale digital systems and complex algorithms.
• Embedded memory: Approximately 51.2 Mbits of on-chip RAM for buffers, FIFOs, and local data storage.
• I/O capacity: 552 I/O pins to support wide parallel interfaces, multi-channel I/O, and board-level connectivity.
• Package and mounting: 1152-FBGA (35×35) surface-mount FCBGA package for compact, high-pin-count board designs.
• Core voltage: Voltage supply range 820 mV to 880 mV to meet device core power requirements.
• Commercial temperature range: Rated for 0 °C to 85 °C operation for standard commercial deployments.
• Environmental compliance: RoHS compliant, supporting regulatory and manufacturing requirements.

Typical Applications

• High-performance signal processing: Dense logic and large embedded memory enable implementation of real-time processing pipelines and packet handling.
• Network and protocol acceleration: High I/O count and family-level transceiver documentation make the device suitable for protocol offload and interface bridging.
• System integration and control: Use the FPGA for glue logic, system controllers, and orchestration where many peripheral interfaces are required.

Unique Advantages

• Substantial on-chip resources: 622,000 logic elements combined with ~51.2 Mbits of embedded memory reduce dependence on external memory and discrete logic.
• High I/O density: 552 I/O pins provide flexibility for parallel buses, multi-lane interfaces, and extensive sensor or peripheral connectivity.
• Compact, high-pin-count package: 1152-FBGA (35×35) FCBGA enables a compact board footprint while preserving routing and signal access.
• Commercial-ready thermal range: Rated 0 °C to 85 °C to match typical commercial product environments and deployment scenarios.
• Clear electrical documentation: The Stratix V device datasheet details electrical and switching characteristics, including I/O timing and transceiver specifications to support verification and integration.
• RoHS compliant: Facilitates regulatory compliance and streamlined manufacturing processes.

Why Choose 5SGXEA7H2F35C3N?

The 5SGXEA7H2F35C3N positions itself as a high-capacity Stratix V GX FPGA that balances dense programmable logic, significant embedded memory, and a large I/O complement in a single surface-mount FCBGA package. It is well suited for design teams building complex digital systems that require integrated memory, heavy logic utilization, and extensive board-level interfacing.

For projects where scalability, on-chip resource consolidation, and adherence to commercial temperature and environmental standards matter, this device provides a clear specification set and supporting datasheet information to guide implementation and system-level validation.

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