5SGXEA7H2F35C3

The 5SGXEA7H2F35C3 is a Stratix V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152-ball FCBGA package. It delivers very large programmable logic capacity and substantial on-chip memory, combined with a high I/O count and a commercial operating grade.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this device targets high-density programmable logic implementations that require extensive logic resources, large embedded RAM, and broad external interfacing capability.

Key Features

• Core Logic  622,000 logic elements to implement complex digital logic, state machines, and compute pipelines.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, lookup tables, and memory-intensive algorithms.
• I/O Capacity  552 user I/Os to enable extensive external connectivity and multi‑lane interface implementations.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to define system power requirements and margining.
• Package & Mounting  1152-ball FCBGA (35 × 35 mm) surface-mount package for compact board-level integration.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and abundant embedded RAM enable implementation of compute-heavy blocks such as packet processing, signal processing, and custom accelerators.
• Multi‑lane interface and bridging  High I/O count supports complex interface routing and protocol conversion between multiple external peripherals and buses.
• System prototyping and integration  The extensive logic and memory resources allow system architects to consolidate multiple functions into a single programmable device for prototyping and integration.

Unique Advantages

• High logic capacity: 622,000 logic elements provide the headroom to implement large-scale, multi-module designs on a single device, reducing the need for multiple FPGAs.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces external memory dependency for many buffering and stateful functions, simplifying board design.
• Extensive I/O: 552 available I/Os enable dense connectivity and flexible pin assignments for diverse system interfaces.
• Compact FCBGA package: 1152-ball FCBGA (35 × 35 mm) supports high interconnect density while maintaining a compact PCB footprint.
• Commercial temperature rating: Designed for standard commercial environments with an operating range of 0 °C to 85 °C.
• RoHS compliant: Meets environmental compliance requirements for lead-free manufacturing flows.

Why Choose 5SGXEA7H2F35C3?

The 5SGXEA7H2F35C3 combines substantial logic resources, large embedded memory, and a high I/O count in a compact FCBGA package—making it a strong candidate for designers requiring consolidation of complex digital functions into a single programmable device. Its commercial-grade rating and clearly defined power and thermal parameters simplify system-level planning and integration.

This part is appropriate for engineering teams and procurement focused on high-density FPGA implementations that need scalable logic and memory resources, flexible interfacing, and RoHS-compliant hardware suitable for commercial deployments.

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