5SGXEA7H2F35C2N

The 5SGXEA7H2F35C2N is a Stratix® V GX field‑programmable gate array (FPGA) from Intel, offered as a commercial‑grade device. It delivers a high logic capacity FPGA fabric with a large on‑chip memory complement and extensive I/O, packaged in a 1152‑FBGA footprint for surface‑mount assembly.

Designed for demanding digital designs requiring significant programmable logic, embedded memory, and wide I/O counts, this device is suited to applications where high integration and design flexibility are priorities.

Key Features

• Logic Capacity  Provides 622,000 logic elements for complex digital logic implementation and large FPGA designs.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support large buffering, state storage, and memory‑intensive algorithms.
• I/O Density  552 device I/O pins to accommodate extensive external interfacing and high‑pin‑count connectivity.
• Package  1152‑BBGA / 1152‑FBGA (35x35) package case optimized for high‑density, surface‑mount system designs.
• Power Supply  Core voltage supply range 870 mV to 930 mV to match system power domains and design requirements.
• Operating Range & Grade  Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance  Surface‑mount device; RoHS compliant for global environmental standards.
• Stratix V GX Family Characteristics  Part of the Stratix V GX family; family datasheet documents commercial speed‑grade offerings and transceiver speed grade options for GX devices.

Typical Applications

• High‑performance digital signal processing  Large logic capacity and abundant embedded memory enable implementation of complex DSP pipelines and algorithm acceleration.
• High‑density I/O bridging  Extensive I/O count supports wide parallel interfaces, protocol bridging, and multi‑lane connectivity.
• Custom compute and hardware acceleration  Significant logic resources and on‑chip RAM allow offloading compute‑intensive tasks from host processors.

Unique Advantages

• Large programmable fabric: 622,000 logic elements let designers map complex state machines, parallel datapaths, and large custom accelerators on a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory for buffering and local storage, simplifying board design.
• High I/O availability: 552 I/O pins enable broad connectivity to sensors, interfaces, and mezzanine modules without signal multiplexing compromises.
• High‑density package: 1152‑FBGA (35x35) packaging supports compact board layouts while delivering the pin count required for complex systems.
• Commercial operating range: Rated for 0 °C to 85 °C operation to meet typical commercial and enterprise environmental requirements.
• Standards‑aware supply: RoHS compliance supports environmentally regulated product builds.

Why Choose 5SGXEA7H2F35C2N?

The 5SGXEA7H2F35C2N combines a large logic resource pool, substantial embedded memory, and a high I/O count in a compact 1152‑FBGA package, delivering a flexible platform for complex digital designs. As a commercial‑grade Stratix V GX device, it is positioned for engineering teams building high‑integration FPGA solutions that require significant on‑chip resources and broad connectivity.

This device is appropriate for customers focused on scalable FPGA implementations, where robust logic capacity, embedded memory, and system‑level I/O are primary selection criteria. The combination of package density, RoHS compliance, and defined commercial operating limits supports reliable integration into production systems.

Request a quote or submit a purchase inquiry to evaluate 5SGXEA7H2F35C2N for your next FPGA design project.