5SGXEA7H2F35C2LN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 1,238 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7H2F35C2LN – Stratix V GX FPGA, 552 I/O, 1152-BBGA (FCBGA)

The 5SGXEA7H2F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) offered in a 1152-BBGA (FCBGA) package. It provides a high-logic-density programmable fabric combined with substantial on-chip memory and a large I/O count, targeting complex digital designs that require significant integration.

With 622,000 logic elements, approximately 51 Mbits of embedded memory, and 552 I/Os, this commercial-grade, surface-mount device is suited to applications that demand dense logic, extensive buffering or storage, and broad external connectivity while operating within a 0 °C to 85 °C temperature range and a core supply range of 0.820–0.880 V.

Key Features

  • Core Logic  622,000 logic elements provide large programmable capacity for complex digital implementations and high integration of custom logic blocks.
  • Embedded Memory  Approximately 51 Mbits of on-chip RAM for frame buffers, FIFOs, and local data storage to support high-throughput designs.
  • High I/O Count  552 available I/Os enable extensive peripheral, sensor, and high-density board-level interfacing.
  • Low-Voltage Core Supply  Specified core supply range from 0.820 V to 0.880 V for compatibility with modern low-voltage system architectures.
  • Package & Mounting  1152-BBGA (FCBGA) supplier package 1152-FBGA (35 × 35 mm) in a surface-mount form factor for compact, high-density board layouts.
  • Commercial Grade & Temperature  Commercial temperature range rated from 0 °C to 85 °C for standard electronic product environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High-performance data processing  Use the large logic fabric and embedded memory for compute-intensive packet processing, signal processing, or custom accelerator functions.
  • Communications and networking equipment  High I/O count and substantial on-chip RAM support complex I/O routing, buffering, and protocol implementation.
  • Video and imaging systems  On-chip memory and dense logic resources enable frame buffering, image pipelines, and custom video processing blocks.
  • Custom SoC and prototyping  Deploy as the programmable heart of prototype systems or specialized SoC replacements where integration and reprogrammability are required.

Unique Advantages

  • High logic density: 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing BOM and board space.
  • Substantial embedded memory: Approximately 51 Mbits of on-chip RAM reduces reliance on external memory for buffering and temporary storage.
  • Extensive connectivity: 552 I/Os provide flexibility for high-pin-count interfaces and multi-channel systems without external multiplexing.
  • Compact FCBGA package: 1152-BBGA (35 × 35 mm supplier package) supports high-density PCB layouts while maintaining a robust mounting style.
  • Low-voltage operation: Core supply range of 0.820–0.880 V aligns with modern low-power system rails.
  • Regulatory peace of mind: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA7H2F35C2LN?

The 5SGXEA7H2F35C2LN delivers a combination of high logic capacity, substantial embedded memory, and a large I/O complement in a commercial-grade Stratix V GX device. Its specification set is intended for designers who need significant on-chip resources and flexible connectivity in a surface-mount FCBGA package.

This FPGA is well suited to systems where consolidation, reprogrammability, and local buffering are priorities—enabling scalable designs that can evolve through firmware updates while leveraging the vendor’s established device family and documentation.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for 5SGXEA7H2F35C2LN.

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