5SGXEA7H2F35C2

The 5SGXEA7H2F35C2 is a Stratix® V GX field-programmable gate array (FPGA) supplied in a 1152-ball FCBGA package. This commercial-grade device integrates a large programmable fabric, substantial on-chip memory, and a high pin count to address complex digital designs.

Engineered for designs requiring high logic density, abundant embedded memory, and extensive I/O, the device delivers the programmability and integration expected from the Stratix V family while operating within a commercial temperature range.

Key Features

• Logic Capacity  Approximately 622,000 logic elements to implement complex, high-density digital logic and custom processing pipelines.
• Embedded Memory  Approximately 51.2 Mbits of embedded memory (total RAM bits: 51,200,000) to support large data buffers, FIFOs, and on-chip storage.
• I/O Resources  Up to 552 I/O pins to support broad peripheral connectivity and multi-channel interfacing in a single device.
• Package & Mounting  1152-BBGA (FCBGA) package, supplied as 1152-FBGA (35×35), surface-mount for compact, board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling precise power budgeting for system designs.
• Temperature & Grade  Commercial temperature grade with operating range from 0 °C to 85 °C, suitable for standard commercial applications.
• Compliance  RoHS compliant, meeting common lead-free and environmental requirements for electronic components.

Typical Applications

• High-density digital systems  Large logic capacity and abundant on-chip RAM make the device suitable for complex FPGA-based processing tasks.
• Multi-channel I/O systems  A high I/O count supports designs that require connectivity to many peripherals, interfaces, or sensor arrays.
• Embedded memory-intensive designs  Approximately 51.2 Mbits of embedded memory supports buffering, packet storage, and data manipulation on-chip.
• Commercial electronics  Commercial temperature rating and surface-mount FCBGA package support typical consumer and enterprise hardware implementations.

Unique Advantages

• High logic density:  Approximately 622K logic elements let you consolidate complex functions into a single FPGA, reducing system-level component count.
• Significant on-chip memory:  About 51.2 Mbits of RAM enables large internal data structures and reduces reliance on external memory for many applications.
• Extensive I/O:  552 I/O pins provide flexibility to interface with multiple subsystems without multiplexing compromises.
• Compact, production-ready package:  1152-BBGA (35×35 FCBGA) packaging balances pin density and PCB footprint for space-constrained boards.
• Designed for commercial deployments:  Commercial temperature grade and RoHS compliance simplify integration into mainstream electronics products.
• Predictable power envelope:  Defined core voltage range (870 mV–930 mV) aids in accurate power-supply design and thermal planning.

Why Choose 5SGXEA7H2F35C2?

The 5SGXEA7H2F35C2 positions itself as a high-density, commercially graded Stratix V GX FPGA option for designs that need a large programmable fabric, substantial embedded memory, and broad I/O capability in a compact FCBGA package. Its specified core voltage range and commercial operating temperature make it suitable for a wide range of mainstream electronic systems.

For teams building complex digital systems that require on-chip memory and plentiful I/O without moving to industrial temperature grades, this device offers a scalable platform backed by the Stratix V device family specifications and documented electrical characteristics.

Request a quote or submit a product inquiry to obtain availability, pricing, and lead-time information for 5SGXEA7H2F35C2.