5SGXEA7H2F35C1G

The 5SGXEA7H2F35C1G is a high-density Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a large programmable fabric with 622,000 logic elements and substantial on-chip memory to support complex digital designs.

Targeted for commercial applications, this device combines a high I/O count and a compact 1152‑BBGA FCBGA package with a low-voltage core supply range, making it suitable for systems that require dense logic integration and extensive I/O connectivity within a commercial temperature window.

Key Features

• Logic Capacity 622,000 logic elements provide extensive programmable fabric for large-scale logic integration and complex algorithm implementation.
• Embedded Memory Approximately 51.2 Mbits of on‑chip RAM to support buffering, on-chip data storage, and memory-heavy logic functions.
• I/O Resources 552 user I/O pins to support wide parallel interfaces and diverse peripheral connectivity requirements.
• Power and Voltage Core voltage supply range from 870 mV to 930 mV, enabling designers to plan power delivery and thermal budgets precisely.
• Package and Mounting 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) with surface‑mount construction for compact board-level integration.
• Operating Environment Commercial grade operation with a specified operating temperature range of 0 °C to 85 °C.
• Standards and Compliance RoHS compliant, supporting environmental regulatory requirements for lead‑free assembly.

Typical Applications

• High‑density digital processing — Implement large-scale custom logic, signal processing pipelines, and algorithm acceleration using 622,000 logic elements and ample embedded memory.
• I/O‑intensive systems — Support boards and modules that require many parallel interfaces or complex pinout routing with 552 available I/Os.
• Prototyping and system integration — Use the device in commercial development platforms where high logic capacity and on‑chip memory simplify design iterations and integration tasks.

Unique Advantages

• High logic density: 622,000 logic elements let you consolidate large designs onto a single FPGA, reducing board-level complexity.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM supports data buffering and state storage without external memory in many use cases.
• Abundant I/O: 552 I/Os enable broad interfacing options for sensors, peripherals, and parallel data buses.
• Compact, manufacturable package: 1152‑BBGA FCBGA with surface‑mount mounting facilitates dense PCB layouts and production‑friendly assembly.
• Commercial temperature rating: Specified 0 °C to 85 °C operation aligns with a wide range of commercial electronic products.
• RoHS compliance: Conforms to lead‑free manufacturing and environmental restrictions.

Why Choose 5SGXEA7H2F35C1G?

The 5SGXEA7H2F35C1G positions itself as a high‑capacity, commercially graded Stratix V GX FPGA designed for projects that require extensive logic resources, significant on‑chip memory, and a high number of I/Os in a compact BGA package. Its specified core voltage range and commercial operating temperature make it suitable for production systems where predictable power and thermal planning are important.

This device is well matched to teams building complex digital systems, integration platforms, and high‑I/O interfaces that benefit from a single, densely provisioned FPGA. Documentation and device characteristics from the Stratix V family support design and verification activities throughout development.

Request a quote or submit an inquiry for part number 5SGXEA7H2F35C1G to receive pricing, lead time, and availability information for your project needs.