5SGXEA7H3F35C3

The 5SGXEA7H3F35C3 is a Stratix® V GX field programmable gate array (FPGA) in a 1152‑BBGA FCBGA package. This commercial‑grade FPGA delivers high logic capacity, large on‑chip memory, and a high I/O count for complex, high‑density programmable designs.

Its core characteristics — 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os — make it suitable for applications that require substantial programmable logic, significant on‑chip RAM, and dense external interfacing while operating within a 0 °C to 85 °C commercial temperature range.

Key Features

• Logic Capacity — 622,000 logic elements and approximately 234,720 logic blocks provide large-scale programmable fabric for complex algorithms and parallel processing.
• On‑chip Memory — Approximately 51.2 Mbits of total RAM bits for buffering, look‑up tables, and data storage inside the FPGA.
• I/O Density — 552 user I/O pins to support extensive external connectivity and multi‑lane interfacing.
• Package — 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, 35×35) for high‑density PCB implementation and surface mount assembly.
• Power Supply — Core voltage supply range from 820 mV to 880 mV to match platform power domains.
• Operating Range — Commercial temperature grade with an operating temperature range of 0 °C to 85 °C.
• Mounting Type — Surface mount package suitable for modern PCB assembly processes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High‑density logic systems — Use where large programmable logic capacity and many logic blocks are required for custom processing and control functions.
• On‑chip memory‑intensive designs — Ideal for designs needing substantial embedded RAM for buffering, packet processing, or state storage.
• High‑I/O interfacing — Suited to systems requiring hundreds of I/Os for multi‑lane data paths, parallel sensors, or wide external buses.

Unique Advantages

• Large programmable fabric: 622,000 logic elements provide capacity for complex logic synthesis and IP integration, reducing the need for multiple devices.
• Significant embedded memory: Approximately 51.2 Mbits of on‑chip RAM enables local buffering and memory‑centric algorithms without extensive external memory.
• High I/O count: 552 I/Os allow dense connectivity and flexible interfacing to peripherals, serializers, or parallel busses.
• Compact, industry‑standard package: 1152‑BBGA (35×35) FCBGA delivers high pin density in a surface‑mount form factor suitable for space‑constrained PCBs.
• Commercial operating range: Rated for 0 °C to 85 °C, aligning with standard commercial deployments and environments.
• Regulatory alignment: RoHS compliance supports materials and manufacturing requirements for a wide range of products.

Why Choose 5SGXEA7H3F35C3?

The 5SGXEA7H3F35C3 delivers a balance of very high logic density, substantial embedded memory, and broad I/O capability in a compact FCBGA package. Its specifications make it well suited for designers building large, integration‑focused FPGA systems that must fit within commercial temperature and voltage ranges.

This device is appropriate for teams and projects that require scalable programmable logic resources, significant on‑chip RAM, and dense external connectivity while maintaining RoHS compliance and standard surface mount assembly practices.

Request a quote or submit your RFQ to receive pricing, lead‑time, and availability information for the 5SGXEA7H3F35C3. Our team can assist with procurement and volume inquiries.