5SGXEA7H3F35C3WN

The 5SGXEA7H3F35C3WN is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered as a commercial-grade device in a 1152-BBGA FCBGA package. It delivers very high logic density and substantial on-chip memory, making it suitable for complex, resource-intensive designs that require large programmable logic and embedded RAM.

Key electrical and device-level characteristics for the Stratix V family, including operating conditions and switching behavior, are documented in the Stratix V device datasheet, which covers speed grades, electrical characteristics, and transceiver information for the family.

Key Features

• Core logic  622,000 logic elements for high-density programmable logic implementation.
• Embedded memory  Approximately 51 Mbits of on-chip RAM to support large buffer, LUT, and state storage requirements.
• High I/O count  552 user I/Os to accommodate wide parallel interfaces and dense connectivity.
• Package & mounting  1152-BBGA, FCBGA supply package (listed as 1152-FBGA (35×35)) in a surface-mount form factor.
• Power  Core supply range of 820 mV to 880 mV to align with Stratix V core voltage requirements.
• Temperature & grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant device for environmental regulatory adherence.

Typical Applications

• High-density logic implementation  Leverage 622,000 logic elements to consolidate complex digital logic into a single FPGA.
• Memory-intensive designs  Use approximately 51 Mbits of embedded RAM for large buffers, packet processing, or on-chip data storage.
• High-pin-count interface systems  552 I/Os enable broad connectivity for multi-lane interfaces, parallel buses, and dense peripheral integration.
• Prototyping and system integration  Surface-mount 1152-BBGA packaging supports integration into compact, production-level PCBs.

Unique Advantages

• Large programmable fabric: 622,000 logic elements provide the capacity to implement complex algorithms and large custom accelerators on-chip.
• Substantial on-chip RAM: Approximately 51 Mbits of embedded memory reduces reliance on external RAM for many buffering and storage tasks.
• Extensive I/O availability: 552 I/Os give designers flexibility to connect multiple subsystems without external multiplexing.
• Compact, production-ready package: 1152-BBGA (1152-FBGA 35×35) surface-mount package supports high-density board designs and automated assembly.
• Documented device characteristics: Electrical and switching characteristics for the Stratix V family are provided in the official device datasheet to support design and validation.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA7H3F35C3WN?

The 5SGXEA7H3F35C3WN positions itself as a high-capacity, commercially graded Stratix V GX FPGA suited for designs that require significant logic resources, embedded memory, and broad I/O. Its core voltage range, operating temperature window, and package details are documented to support system-level power and thermal planning.

This device is appropriate for engineering teams integrating large programmable fabrics and substantial on-chip memory into compact, surface-mount solutions, and for projects that rely on the Stratix V family’s documented electrical and switching characteristics.

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