5SGXEA7H3F35C4N

The 5SGXEA7H3F35C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC. It delivers high logic capacity and extensive I/O density in a 1152-BBGA FCBGA package for commercial-grade designs.

With 622,000 logic elements and 51200000 total RAM bits, this device is intended for designs that require large on-chip memory and high logic density, while offering a broad I/O complement (552 pins) and a low-voltage core supply range.

Key Features

• Core Capacity — 622,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM (51.2 Mbits = 51.2 million bits) for buffering, FIFOs, and scratchpad storage.
• I/O Count — 552 I/O pins to support dense peripheral interfacing and multi-channel connectivity.
• Logic Fabric Blocks — 234,720 logic fabric blocks (as listed in device data) for structured logic grouping and routing.
• Power — Core voltage supply range of 820 mV to 880 mV, enabling designs that target this low-voltage core operating point.
• Package & Mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting type for PCB assembly.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant, meeting common lead-free requirements for commercial electronics.
• Series-Level Transceiver Capability — The Stratix V GX family datasheet documents GX transceiver channel options (series-level information includes GX channels up to 14.1 Gbps); refer to the series datasheet for transceiver speed-grade details.

Typical Applications

• High-density logic implementations — Leverage the 622,000 logic elements and ample embedded memory for large-scale programmable logic, state machines, and custom compute blocks.
• Data buffering and packet processing — The approximately 51.2 Mbits of on-chip RAM supports buffering, packet queues, and temporary storage in data-path designs.
• Dense I/O and interface aggregation — 552 I/O pins enable multi-channel interfaces, protocol bridging, and board-level aggregation of peripherals or transceivers.
• High-speed serial (family-level) — Designs that require Stratix V GX family transceiver capabilities can reference the series datasheet for supported GX channel speeds and grades.

Unique Advantages

• Large logic and memory integration: 622,000 logic elements combined with approximately 51.2 Mbits of embedded RAM reduce external memory dependence and simplify BOM.
• High I/O density: 552 I/O pins provide flexibility for multi-protocol designs and complex board-level connectivity without multiple devices.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
• Compact, production-ready package: 1152-BBGA FCBGA (1152-FBGA 35×35) surface-mount package supports high-density PCBs and automated assembly.
• Regulatory readiness: RoHS compliance supports lead-free product development and regulatory conformity for commercial electronics.

Why Choose 5SGXEA7H3F35C4N?

This Stratix V GX FPGA part delivers a combination of high programmable logic capacity, substantial on-chip memory, and broad I/O resources in a commercial-grade, surface-mount BBGA package. It is well suited to engineers building dense digital systems that require integrated memory and flexible interfacing while operating within a 0 °C to 85 °C commercial temperature range.

Engineers and procurement teams selecting this device gain access to the Stratix V GX family capabilities documented in the series datasheet, with a device-level specification set that supports complex logic implementations and high I/O counts in a compact package.

Request a quote or submit a pricing inquiry to evaluate 5SGXEA7H3F35C4N for your next high-density FPGA design.