5SGXEA7H3F35I3L

The 5SGXEA7H3F35I3L is a Stratix® V GX FPGA IC from Intel, delivered in a 1152-BBGA FCBGA package. It provides a high-density, industrial-grade programmable logic platform for complex digital integration and system-level functions.

Built for designs that require large on-chip logic and memory resources, this device targets industrial applications where temperature range, I/O count, and power domain characteristics are important design considerations.

Key Features

• High logic capacity — Approximately 622,000 logic elements to implement large-scale logic, control, and datapath functions.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• Rich I/O — 552 available I/Os to support dense peripheral connectivity and multi-channel interfaces.
• Package and mounting — Supplied in a 1152-BBGA (1152-FBGA, 35×35) package for surface-mount assembly and high pin-count routing.
• Power domain — Core voltage supply range of 820 mV to 880 mV to match target system power architectures.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C for robust performance in industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Industrial control and automation — Use the device’s large logic capacity and industrial temperature rating for complex control algorithms, motor drives, and factory automation systems.
• High-density digital processing — On-chip memory and extensive logic resources enable implementation of signal processing pipelines, packet processing, and custom compute blocks.
• Telecommunications and networking — High I/O count and Stratix V GX family transceiver capabilities (as documented in the device family datasheet) support multi-channel networking and protocol bridging.
• Embedded system integration — Combine logic, memory, and abundant I/Os to consolidate multiple system functions and reduce external component count.

Unique Advantages

• Large programmable fabric: ~622,000 logic elements let you implement complex state machines, datapaths, and custom processors on a single device.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• High I/O density: 552 I/Os provide flexible connectivity for high-channel-count systems and multiple peripheral interfaces.
• Industrial-rated operation: –40 °C to 100 °C operating range supports deployment in demanding industrial environments.
• Optimized core voltage range: 0.82–0.88 V core supply supports integration into modern multi-rail power architectures.
• High-density BGA packaging: 1152-BBGA (35×35) package enables compact board layouts while supporting high signal density.

Why Choose 5SGXEA7H3F35I3L?

The 5SGXEA7H3F35I3L delivers a balance of large logic and memory resources, extensive I/O, and industrial-grade environmental tolerance, making it suited for system designs that require substantial on-chip integration and robust operation. As a member of the Stratix V GX family, it aligns with the device family electrical and switching characteristics documented in the Stratix V device datasheet.

This FPGA is appropriate for engineering teams building high-density, industrial applications where consolidation of functionality, flexible I/O, and on-chip memory are key to reducing BOM complexity and meeting performance targets.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA7H3F35I3L Stratix® V GX FPGA.