5SGXEA7H3F35I3LN

The 5SGXEA7H3F35I3LN is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density, industrial applications. It delivers a large programmable fabric, substantial on-chip memory, and a high I/O count in a compact 1152-ball FBGA package.

Engineered for systems that require extensive logic, memory, and connectivity within an industrial temperature envelope, this device is suited to complex programmable designs where integration and reliability are priorities.

Key Features

• High Logic Density — Approximately 622,000 logic elements for implementing large-scale digital designs and complex control logic.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM to support buffering, lookup tables, and data-path storage without external DRAM for many functions.
• Extensive I/O — 552 user I/O pins to support dense peripheral, sensor, and system interconnect requirements.
• Industrial Operating Range — Rated for operation from −40 °C to 100 °C, suitable for industrial environments and equipment.
• Low-voltage Core Supply — Core voltage supply range of 820 mV to 880 mV to match modern FPGA power domains and enable efficient core operation.
• Package and Mounting — 1152-ball BGA (1152-FBGA, 35 × 35 mm) surface-mount package providing a compact, high-pin-count footprint for dense board layouts.
• RoHS Compliant — Meets RoHS environmental standards for lead-free manufacturing.

Typical Applications

• Industrial Control & Automation — Use the device’s high logic density and industrial temperature rating to implement motor control, PLC functions, and real-time control systems.
• Networking & Communications — Large programmable fabric and abundant I/O enable packet processing, protocol bridging, and midplane or board-level interfacing in communication equipment.
• Signal Processing & Acceleration — Substantial on-chip RAM and logic resources support DSP pipelines, hardware acceleration, and custom data-path implementations.
• System Integration & Prototyping — Dense integration of logic, memory, and I/O simplifies board-level design and accelerates development of complex prototypes and production systems.

Unique Advantages

• Highly integrated programmable fabric: 622,000 logic elements reduce the need for external ASICs or multiple FPGAs, simplifying BOM and board area.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM enables scalable buffering and local data storage for low-latency designs.
• Wide I/O capability: 552 I/O pins offer flexibility for mixed-signal interfaces, parallel busses, and dense sensor or peripheral connections.
• Industrial reliability: Specified for −40 °C to 100 °C operation to meet the demands of harsh or temperature-variable environments.
• Compact high-density package: 1152-ball FBGA (35 × 35 mm) provides a high pin count in a space-efficient footprint for complex PCBs.
• RoHS compliant and surface-mount ready: Supports modern manufacturing and environmental requirements.

Why Choose 5SGXEA7H3F35I3LN?

The 5SGXEA7H3F35I3LN combines a very large logic capacity with sizable embedded memory and extensive I/O in a single industrial-grade FPGA. This balance of resources supports large, integration-heavy designs while maintaining board-space efficiency through a dense FBGA package.

Choose this Stratix V GX device when your design requires substantial programmable resources, robust operation across industrial temperatures, and a compact, manufacturable package. Its specification set supports scalable system architectures and long-term deployment in industrial and high-performance applications.

Request a quote or submit an inquiry for 5SGXEA7H3F35I3LN to obtain pricing and availability for your next design.