5SGXEA7H1F35C1N

The 5SGXEA7H1F35C1N is a Stratix® V GX field programmable gate array (FPGA) IC offered in a 1152‑BBGA FCBGA package. It delivers a high-density programmable fabric with substantial embedded memory and a large I/O count for demanding commercial applications.

This device is supplied in a commercial temperature grade (0 °C to 85 °C) and is documented as part of the Stratix V device family, which includes detailed electrical and transceiver specifications in the Stratix V Device Datasheet.

Key Features

• High logic capacity — 622,000 logic elements (cells) to implement large-scale designs and complex logic functions.
• Substantial embedded memory — approximately 51.2 Mbits of on-chip RAM for buffering, tables, and data-path storage.
• Extensive I/O — 552 I/O pins to support high port counts and diverse peripheral interfacing.
• Power and core supply — core voltage supply range of 870 mV to 930 mV, enabling defined power planning for system integration.
• Commercial temperature grade — rated for operation from 0 °C to 85 °C for standard commercial deployments.
• Package and mounting — 1152‑BBGA FCBGA (supplier device package: 1152‑FBGA, 35×35) in a surface-mount form factor suitable for low-profile board designs.
• RoHS compliant — meets RoHS environmental requirements for lead‑free manufacturing.

Typical Applications

• High-density digital processing — Leverage the 622,000 logic elements and large embedded memory to implement complex state machines, control logic, and data-path processing.
• Packet processing and networking — Use the high I/O count and on-chip memory for packet buffering, classification, and protocol handling in commercial networking equipment.
• Prototyping and system integration — Deploy as a configurable system hub where dense logic and numerous I/Os are required to integrate peripherals and custom IP.

Unique Advantages

• High-capacity programmable fabric: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Large embedded memory resource: Approximately 51.2 Mbits of RAM supports buffering, lookup tables, and on-chip data structures without external memory in many designs.
• Large I/O scalability: 552 I/Os facilitate multi-channel interfacing and flexible boundary connections for system-level integration.
• Compact surface-mount package: The 1152‑BBGA FCBGA (35×35) package offers a high I/O count and dense routing in a standard surface-mount form factor.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream commercial deployments and environments.
• Environmentally compliant: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose 5SGXEA7H1F35C1N?

The 5SGXEA7H1F35C1N positions itself as a high-density, high-I/O Stratix V GX FPGA targeted at commercial designs that require significant on-chip logic and memory resources. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 552 I/Os makes it suitable for complex digital processing, networking, and system-integration tasks where density and interface flexibility matter.

Supported by the Stratix V device family documentation and electrical characterization, this device provides a verifiable specification set for power, I/O, and thermal planning—helping teams move from design to production with clear, datasheet-backed parameters.

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