5SGXEA5N3F45C2N

The 5SGXEA5N3F45C2N is an Intel Stratix V GX-series FPGA offering a large programmable fabric with 490,000 logic elements and approximately 46.08 Mbits of embedded on‑chip RAM. The device provides up to 840 I/Os in a high‑density 1932‑ball FCBGA package and is supplied as a commercial‑grade, surface‑mount device.

Designed for designs that require substantial logic capacity, abundant on‑chip memory and extensive I/O, this Stratix V GX device delivers the silicon resources needed for complex digital systems while operating within a core supply range of 870 mV to 930 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  490,000 logic elements provide a large programmable fabric for complex designs and high integration density.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑intensive logic functions.
• I/O Density  Up to 840 I/Os to support high‑pin‑count interfaces and multi‑lane connectivity.
• Transceiver Capability (family)  Stratix V GX family transceiver speed grades are documented in the device datasheet, with channel rate offerings reported up to 14.1 Gbps for the GX devices.
• Power and Voltage  Defined core supply voltage range of 870 mV to 930 mV for regulated core power budgeting.
• Package & Mounting  1932‑ball FCBGA package (supplier package listed as 1932‑FBGA, FC (45 × 45)) optimized for surface‑mount assembly in high‑density board designs.
• Temperature Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance  RoHS‑compliant construction.

Typical Applications

• High‑density digital processing  Large logic capacity and substantial on‑chip RAM support complex state machines, packet processing, and data path aggregation.
• Multi‑I/O systems  High I/O count enables dense front‑panel or backplane interfacing, board‑level aggregation, and multi‑protocol bridging.
• Memory‑intensive functions  On‑chip RAM enables buffering, queuing, and temporary storage for streaming and real‑time data handling.

Unique Advantages

• Large programmable fabric: 490,000 logic elements allow consolidation of multiple functions into a single device, reducing external component count.
• Significant on‑chip RAM: Approximately 46.08 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• High I/O capacity: 840 I/Os simplify system partitioning and minimize the need for external I/O expanders.
• Commercial temperature and RoHS compliance: Clearly defined 0 °C to 85 °C operating range and RoHS status support standard commercial product deployments.
• High‑density packaging: 1932‑ball FCBGA (45 × 45) enables compact board layouts for space‑constrained, high‑pin‑count applications.

Why Choose 5SGXEA5N3F45C2N?

The 5SGXEA5N3F45C2N Stratix V GX FPGA combines a very large logic element count with substantial embedded memory and high I/O density in a single commercial‑grade FCBGA package. This configuration is suitable for designers who need to integrate complex digital functions and large on‑chip storage while preserving board‑level space and minimizing external components.

With defined supply and temperature ranges and family‑level transceiver performance documented in the device datasheet, this device is positioned for customers building high‑density digital systems that require predictable electrical parameters and a rich silicon resource set.

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