5SGXEA5N3F45C2LG

The 5SGXEA5N3F45C2LG is an Intel Stratix® V GX Field Programmable Gate Array packaged in a 1932-ball FCBGA. It delivers high-density programmable logic and on-chip memory, combined with a large I/O count, for commercial temperature applications.

Designed for systems that require significant programmable logic capacity and extensive I/O, this device targets high-density digital designs where embedded memory and flexible interfacing are key considerations.

Key Features

• High Logic Capacity — 490,000 logic elements to support large-scale digital designs and complex logic integration.
• Substantial Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive algorithms.
• Extensive I/O — 840 user I/O pins for broad connectivity to peripherals, high-speed interfaces, and board-level routing.
• Package and Mounting — 1932-ball BGA (FCBGA) package; supplier device package listed as 1932-FBGA FC (45×45); surface-mount mounting type for compact board implementations.
• Low-Voltage Core Supply — Core supply range specified at 820 mV to 880 mV to match modern low-voltage power rails.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Use the device where large amounts of combinational and sequential logic are required on a single programmable device.
• Memory-intensive algorithms — Leverage approximately 46 Mbits of embedded RAM for buffering, lookup tables, and on-chip data storage.
• Complex I/O interfacing — The 840 I/O pins accommodate wide parallel buses, diverse peripheral interfaces, and dense board-level connectivity.

Unique Advantages

• Large-scale integration: 490,000 logic elements enable consolidation of multiple functions into one FPGA, reducing system component count.
• On-chip memory capacity: Approximately 46 Mbits of embedded RAM minimizes external memory needs for many applications, simplifying board design.
• Extensive connectivity: 840 I/O pins provide flexibility for complex interface requirements and high pin-count designs.
• Compact, manufacturable package: 1932-ball FCBGA with surface-mount mounting supports high-density PCB layouts and established assembly processes.
• Designed for commercial environments: Rated for 0 °C to 85 °C and RoHS compliant to meet standard commercial deployment requirements.
• Low-voltage core operation: 820 mV–880 mV supply range aligns with contemporary low-voltage power architectures.

Why Choose 5SGXEA5N3F45C2LG?

This Stratix V GX device combines very high programmable logic capacity, significant embedded memory, and a large I/O count in a single commercial-grade FCBGA package. It is appropriate for engineering teams aiming to consolidate complex digital functions and memory-intensive tasks into one FPGA while maintaining a high pin count for system-level interfacing.

The combination of density, on-chip RAM, and packaging makes the 5SGXEA5N3F45C2LG suitable for projects where integration, board-area efficiency, and commercial-temperature operation are key selection criteria.

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