5SGXEA5N3F40I4G

The 5SGXEA5N3F40I4G is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. Designed for high-density, industrial-grade applications, it combines large logic capacity, substantial embedded memory, and a wide I/O count for complex digital system implementations.

This device targets designs that require significant on-chip resources and robust operating margins, offering industrial temperature operation and a low-voltage core supply for power-sensitive deployments.

Key Features

• Logic Capacity  490,000 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffer, cache, and packet-processing requirements.
• I/O Density  600 user I/Os to accommodate wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Power and Core Supply  Core voltage supply range of 820 mV to 880 mV for low-voltage core operation and power-optimized designs.
• Package and Mounting  1517-BBGA (1517-FBGA / 40×40) FCBGA package in a surface-mount format for compact, high-pin-count board layouts.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial and harsh-environment applications.
• RoHS Compliant  Meets RoHS requirements for environmental compliance.

Typical Applications

• Industrial Control and Automation  Industrial temperature rating and high logic/memory capacity make this device suitable for complex control, motion, and process-automation controllers.
• Multi‑lane Interface and Protocol Bridging  High I/O count supports wide parallel interfaces and multiple serial lanes for protocol conversion and interface aggregation.
• Data Processing and Packet Handling  Large embedded RAM and abundant logic elements enable on-chip buffering, packet inspection, and real-time data-path acceleration.
• High-density System Integration  The 1517-BBGA package and surface-mount design allow compact board layouts where high pin count and routing density are required.

Unique Advantages

• Substantial On-chip Resources: 490,000 logic elements and roughly 46.08 Mbits of RAM reduce reliance on external logic and memory, simplifying system architecture.
• High I/O Scalability: 600 I/Os provide design flexibility for parallel interfaces, multi-channel sensors, and dense interconnect requirements.
• Industrial-grade Reliability: Rated to operate from −40°C to 100°C to meet the environmental demands of industrial deployments.
• Compact, High-pin-count Package: The 1517-BBGA (40×40) FCBGA surface-mount package enables high-density integration while maintaining signal routing capacity.
• Low-voltage Core Operation: Core supply range of 820–880 mV supports power-optimized system designs.
• Regulatory Compliance: RoHS compliance supports modern environmental and supply-chain requirements.

Why Choose 5SGXEA5N3F40I4G?

The 5SGXEA5N3F40I4G combines high logic density, significant embedded memory, and an extensive I/O count in an industrial-grade, surface-mount BBGA package. Its specifications support complex digital designs that require on-chip resources, broad connectivity, and reliable operation across a wide temperature range.

Engineers building advanced industrial systems, high-density interface modules, or on-board data-processing solutions will find the device suited to designs that demand integrated memory and high logic capacity while preserving board-area efficiency and environmental robustness.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA5N3F40I4G.