5SGXEA5N3F40I3G

The 5SGXEA5N3F40I3G is a Stratix V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade and packaged in a 1517-BBGA FCBGA (1517-FBGA, 40×40) form factor. It integrates high logic and memory capacity with a large I/O count to support dense, high-performance FPGA designs.

Documented in the Stratix V device datasheet, this GX-family device targets designs requiring substantial on-chip logic and RAM, extensive I/O, and industrial operating range while operating from a low-voltage core supply.

Key Features

• Core Logic Capacity — 490,000 logic elements and 185,000 logic array blocks (LABs) provide a high density of programmable logic resources for complex designs.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM for data buffering, state storage, and embedded memory functions.
• High I/O Count — 600 user I/Os to support wide parallel interfaces, dense front-panel connectivity, and multi-channel systems.
• Package & Mounting — 1517-BBGA FCBGA package (supplier package: 1517-FBGA 40×40) with surface-mount mounting type for compact board integration.
• Power — Core voltage supply range of 820 mV to 880 mV to match low-voltage core power domains.
• Industrial Temperature Grade — Operating temperature range from −40°C to 100°C for use in industrial environments.
• Standards Compliance — RoHS compliant.

Typical Applications

• High-speed transceiver systems — The Stratix V GX family documentation includes transceiver specifications and switching characteristics, supporting designs that require advanced transceiver and SerDes performance.
• I/O-dense embedded systems — With 600 I/Os, this device suits applications needing wide parallel interfaces, multi-channel data aggregation, or dense front-panel connectivity.
• Complex logic and prototyping — Large logic element and LAB counts enable implementation of substantial custom logic, algorithm acceleration, and system integration on a single FPGA.
• Memory-intensive processing — Approximately 46 Mbits of embedded RAM provide on-chip buffering and storage for packet processing, frame buffering, and state machines.

Unique Advantages

• High integration density: 490,000 logic elements and 185,000 logic array blocks reduce the need for multiple devices in complex designs.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM simplifies system memory architecture and lowers external memory dependency.
• Extensive I/O resources: 600 user I/Os enable broad connectivity and flexible interface partitioning on a single package.
• Industrial operating range: Rated from −40°C to 100°C to meet elevated environmental requirements in industrial deployments.
• Low-voltage core operation: 820 mV to 880 mV core supply supports low-power core domains and modern power architectures.
• Compact FCBGA package: 1517-BBGA (1517-FBGA 40×40) offers dense integration for space-constrained boards.

Why Choose 5SGXEA5N3F40I3G?

The 5SGXEA5N3F40I3G positions itself as a high-density Stratix V GX FPGA option for engineers who need substantial logic, memory, and I/O in an industrial-temperature, surface-mount package. Its combination of nearly half a million logic elements, approximately 46 Mbits of embedded RAM, and 600 I/Os enables consolidated system designs that minimize external components and PCB complexity.

This device is documented within the Stratix V device family literature, providing electrical and switching characteristics useful for planning power, thermal, and I/O timing in demanding designs. It is suited to customers building scalable, high-performance FPGA-based systems that require robust logic capacity, extensive connectivity, and industrial temperature operation.

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