5SGXEA5N3F40C3N

IC FPGA 600 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 46080000 490000 1517-BBGA, FCBGA

Quantity 1,802 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N3F40C3N – Stratix® V GX FPGA, 490,000 logic elements

The 5SGXEA5N3F40C3N is a Stratix V GX field programmable gate array (FPGA) offered in a 1517-BBGA (1517-FBGA, 40×40) surface-mount package. It combines high logic density, substantial on-chip memory, and a large I/O count to address complex digital designs and high‑bandwidth interfaces within commercial temperature applications.

With 490,000 logic elements and approximately 46 Mbits of embedded memory, this device targets designs that require large programmable fabric, extensive I/O connectivity, and tightly controlled supply and thermal operating windows.

Key Features

  • Core Logic 490,000 logic elements provide extensive programmable resources for complex logic, DSP, and control implementations.
  • Embedded Memory Approximately 46 Mbits of on-chip RAM enable large buffering, lookup tables, and memory-intensive architectures without external memory dependency.
  • I/O Capacity 600 user I/Os support broad interface counts and parallel connection requirements for multi‑lane systems and high-pin-count peripherals.
  • Packaging & Mounting 1517-BBGA (1517-FBGA, 40×40) package in a surface‑mount form factor simplifies PCB integration for high‑density board designs.
  • Power Supply Core voltage supply range is specified between 820 mV and 880 mV, allowing precise power budgeting and regulation design.
  • Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C for standard commercial deployments.
  • Environmental Compliance RoHS-compliant to meet common regulatory and environmental requirements for commercial electronics.

Typical Applications

  • Network & Communications High logic density and large I/O count support protocol implementation, packet processing, and multi‑lane interface functions.
  • High-performance Digital Systems Substantial embedded memory and abundant logic resources are suited to complex state machines, DSP blocks, and data-path architectures.
  • Data Aggregation & Switching The combination of logic capacity and many I/Os enables aggregation, buffering, and custom switching solutions in commercial systems.

Unique Advantages

  • High logic density: 490,000 logic elements give designers headroom for complex functionality without partitioning across multiple devices.
  • Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduce reliance on external memory and simplify board-level BOM.
  • Extensive I/O connectivity: 600 I/Os accommodate high pin-count interfaces and parallel peripherals, easing system integration.
  • Compact, surface-mount package: 1517-BBGA (40×40) enables high-density PCB layouts while maintaining robust electrical connections.
  • Controlled power envelope: Defined core supply between 820 mV and 880 mV supports predictable power design and thermal planning.
  • Commercial temperature grading: Rated for 0 °C to 85 °C operation for deployments in standard commercial environments.

Why Choose 5SGXEA5N3F40C3N?

The 5SGXEA5N3F40C3N provides a balance of large programmable logic resources, embedded memory capacity, and high I/O availability in a single, surface-mount Stratix V GX package. Its specification set is well suited for commercial designs that demand substantial on-chip resources and dense interfacing without moving to multi-chip solutions.

This part is appropriate for engineering teams building complex digital processing, communication, or data-path logic where on-chip memory and I/O scalability are critical. The defined power and temperature ranges support predictable system-level design and integration within commercial product lifecycles.

Request a quote for 5SGXEA5N3F40C3N today to evaluate suitability for your design and to obtain pricing and availability information.

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