5SGXEA5N3F40C4G

The 5SGXEA5N3F40C4G is an Intel Stratix V GX family Field Programmable Gate Array (FPGA) offered in a 1517-BBGA (40×40 FCBGA) package for surface mount applications. It combines very large logic capacity, substantial on-chip embedded memory, and extensive I/O to support dense, I/O‑rich designs in commercial temperature environments.

This device targets designs that require high logic density and flexible I/O: the device provides 490,000 logic elements, approximately 46.08 Mbits of embedded RAM, and up to 600 I/O pins, while operating from an 820 mV to 880 mV core supply and within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic — 490,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Logic Blocks — 185,000 logic block units (as listed) to structure and partition designs for performance and routing efficiency.
• Embedded Memory — Approximately 46.08 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions.
• I/O Density — Up to 600 user I/O pins to support broad external connectivity and parallel interfaces.
• Power — Core supply range of 820 mV to 880 mV; designed for surface-mount implementation.
• Package — 1517-BBGA, FCBGA (listed supplier package: 1517-FBGA, 40×40) delivering a compact, high‑pin‑count footprint.
• Temperature Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-speed serial communication: Stratix V GX series devices include transceiver capabilities suitable for multi‑gigabit serial links (series-level transceiver specifications are provided in the device datasheet).
• Custom accelerators and compute offload: Large logic capacity and substantial on-chip RAM enable hardware acceleration, DSP blocks, and specialized compute engines.
• I/O‑intensive systems: Up to 600 I/O pins support wide parallel buses, extensive peripheral interfacing, and multi-channel I/O aggregation.
• Commercial embedded systems: The commercial temperature grade and surface-mount 1517-BBGA package suit compact, board‑level deployments in commercial products.

Unique Advantages

• High logic density: 490,000 logic elements provide room for complex, large-scale designs without immediate migration to higher-tier devices.
• Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM reduces the need for external memory in many buffering and storage use cases.
• Extensive I/O capability: 600 I/O pins simplify system integration where multiple peripherals, buses, or channels are required.
• Compact, high‑pin package: The 1517-BBGA FCBGA package offers a dense footprint for high-pin-count implementations in board-constrained designs.
• Commercial temperature operation: Rated for 0 °C to 85 °C to match typical commercial product environments and deployments.
• RoHS compliant: Meets RoHS requirements for broad market acceptance.

Why Choose 5SGXEA5N3F40C4G?

The 5SGXEA5N3F40C4G positions itself as a high-capacity, I/O‑rich FPGA solution in the Stratix V GX family for commercial applications. Its combination of nearly half a million logic elements, substantial embedded memory, and hundreds of I/O pins supports demanding designs where integration and on-chip resources reduce external components and simplify board-level architecture.

This device is suited for engineering teams building complex digital systems, custom accelerators, or high‑speed I/O solutions that require a commercially rated FPGA with a compact, high‑pin package and clear electrical operating parameters.

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