5SGXEA5N3F40C2LN

The 5SGXEA5N3F40C2LN is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel, designed for high-density digital implementations. The device combines extensive logic resources, large on-chip memory, and a high I/O count to support complex system designs in communications, compute acceleration, and advanced signal processing.

With a core supply range of 820 mV to 880 mV and a commercial operating temperature range of 0 °C to 85 °C, this surface-mount FCBGA device is suited to commercial-grade applications requiring significant integration and high interconnect capacity.

Key Features

• Logic Capacity  Approximately 490,000 logic elements (logic cells) to implement large, complex designs and multi-function systems.
• On-chip Memory  Approximately 46.08 Mbits of embedded RAM (46,080,000 bits) for local storage, buffering, and state machine requirements.
• I/O Density  600 user I/O pins to support broad peripheral and high-pin-count interfacing requirements.
• Package  1517-BBGA FCBGA package (supplier package listed as 1517-FBGA, 40×40) for high-density board integration.
• Power  Core voltage supply specified between 820 mV and 880 mV for the device core.
• Mounting & Grade  Surface-mount device, commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental  RoHS compliant.

Typical Applications

• Networking and Communications  High logic density and large I/O count enable complex packet processing, protocol bridging, and multi-port interfacing.
• Compute Acceleration  On-chip RAM and abundant logic elements support custom acceleration blocks and data-path offload in compute systems.
• Signal Processing  Large embedded memory and dense logic resources support DSP algorithms, real-time filtering, and data aggregation tasks.

Unique Advantages

• High integration density: 490,000 logic elements let you consolidate multiple functions into a single FPGA, reducing board complexity.
• Large embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces reliance on external memory for buffering and state retention.
• Extensive I/O support: 600 I/Os provide flexibility for interfacing to numerous peripherals, high-speed PHYs, and complex mezzanine connections.
• Compact, manufacturable package: 1517-BBGA FCBGA (1517-FBGA, 40×40) enables dense PCB layouts while supporting surface-mount assembly.
• Commercial-grade operating range: Specified 0 °C to 85 °C operation and RoHS compliance for standard commercial deployments.
• Low-voltage core: 0.82–0.88 V supply range helps align power budgeting for modern low-voltage systems.

Why Choose 5SGXEA5N3F40C2LN?

The 5SGXEA5N3F40C2LN delivers a combination of substantial logic capacity, significant on-chip memory, and a high I/O count in a compact FCBGA package—making it well suited to commercial designs that demand integration and flexibility. As a member of the Stratix V GX family from Intel, it provides platform-level capabilities to implement complex data-paths, accelerators, and interface-rich systems.

For design teams targeting high-density FPGA implementations where on-chip RAM, logic resources, and I/O scalability are critical, this device provides a clear hardware foundation and predictable operating parameters for commercial deployments.

Request a quote or submit an inquiry for pricing and availability for the 5SGXEA5N3F40C2LN Stratix V GX FPGA.