5SGXEA5N3F40C2L

The 5SGXEA5N3F40C2L is an Intel Stratix® V GX field‑programmable gate array (FPGA) supplied in a 1517‑BBGA FCBGA package. It delivers high logic density, large on‑chip memory, and an extensive I/O count for complex digital designs.

With 490,000 logic elements, approximately 46 Mbits of embedded memory and 600 I/Os, this commercial‑grade device targets applications that require substantial programmable logic capacity, significant embedded RAM, and broad external connectivity while operating within standard commercial temperature limits.

Key Features

• High Logic Density – 490,000 logic elements to implement large-scale combinational and sequential logic designs.
• Embedded Memory – Total on‑chip RAM of 46,080,000 bits (approximately 46 Mbits) for data buffering, FIFOs, and intermediate storage.
• Extensive I/O – 600 general I/O pins for flexible connectivity to peripherals, memory interfaces, and high‑pin‑count systems.
• Package and Mounting – 1517‑BBGA, FCBGA package (supplier device package 1517‑FBGA, 40×40) with surface‑mount assembly.
• Power Supply – Core supply range from 820 mV to 880 mV, enabling defined power budgeting for the FPGA core.
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operation, suitable for commercial applications.
• RoHS Compliant – Meets RoHS environmental requirements for lead‑free manufacturing.

Typical Applications

• High‑Density Digital Processing – Implement large logic networks and complex state machines using the device's 490,000 logic elements and abundant embedded RAM.
• Data Path and Buffering – Use the approximately 46 Mbits of on‑chip memory for packet buffering, frame storage, and pipeline staging in data‑intensive designs.
• Multi‑I/O Systems – Support designs requiring many external interfaces or parallel connections with up to 600 I/Os.
• FPGA System Integration – Integrate multiple subsystems on a single device to reduce board count and consolidate functionality in commercial products.

Unique Advantages

• Large FPGA Fabric: 490,000 logic elements provide the capacity to implement complex algorithms and large custom hardware accelerators without immediate need for multi‑FPGA partitioning.
• Significant On‑Chip Memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful functions, simplifying board design.
• High Pin Count: 600 I/Os enable dense external connectivity and flexible interfacing to a wide range of peripherals and daughtercards.
• Known Packaging Format: 1517‑BBGA/1517‑FBGA (40×40) package supports surface‑mount assembly and standardized board layout practices.
• Commercial Grade Stability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product development and production.

Why Choose 5SGXEA5N3F40C2L?

The 5SGXEA5N3F40C2L combines substantial programmable logic capacity, sizable embedded memory, and a high I/O count in a single commercial‑grade Stratix V GX FPGA package. It is suited for engineers and teams developing complex, high‑density digital systems that benefit from on‑chip resources and broad external connectivity.

Choosing this device supports scalable designs where logic density, embedded RAM, and interface flexibility are primary considerations, while maintaining production readiness with a surface‑mount 1517‑BBGA package and RoHS compliance.

Request a quote or submit a procurement inquiry to receive pricing and availability details for the 5SGXEA5N3F40C2L.