5SGXEA5N2F45I3LG

The 5SGXEA5N2F45I3LG is a Stratix® V GX field-programmable gate array (FPGA) offered in an industrial temperature grade. It provides a high logic-element count and substantial on-chip memory for complex digital designs that require large programmable fabric and abundant I/O.

Designed for surface-mount deployment in a 1932-BBGA (FCBGA) package, this device is suited to applications that need large programmable capacity, many external interfaces and operation across a wide temperature range.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory  Approximately 46.08 Mbits of embedded RAM for on-chip buffering, FIFOs and data storage.
• I/O Density  840 user I/Os to support extensive peripheral and high-pin-count system interfaces.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Low-voltage Core  Core supply specified from 820 mV to 880 mV to match board power-rail design requirements.
• Package and Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), with surface-mount construction for compact board-level integration.
• Standards Compliance  RoHS compliant for regulatory and environmental alignment.

Typical Applications

• High-density signal processing  Use the large logic and memory resources to implement data-paths, accelerators and custom DSP pipelines.
• Telecommunications and networking  Support complex packet processing, protocol bridging and multi-port I/O aggregation using the device’s high I/O count and large fabric.
• Industrial control and automation  Deploy in industrial systems that require wide temperature operation and significant programmable logic for machine control, deterministic I/O and interface logic.
• Prototyping and complex SoC integration  Leverage the FPGA fabric and embedded RAM to prototype system logic and integrate multiple subsystems on a single device.

Unique Advantages

• Substantial programmable capacity: Approximately 490,000 logic elements provide headroom for complex designs and partitioning of functionality across the FPGA fabric.
• Large on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces external memory dependence and simplifies board-level memory architecture.
• Extensive I/O availability: 840 I/Os enable integration with many peripherals and support high-density interconnects without immediate external expanders.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in harsh and industrial environments.
• Compact surface-mount package: 1932-BBGA (45×45 mm supplier package) allows high-density PCB implementations while maintaining robust BGA connectivity.
• RoHS compliant: Meets environmental regulatory expectations for lead-free assembly.

Why Choose 5SGXEA5N2F45I3LG?

The 5SGXEA5N2F45I3LG combines high logic density, substantial embedded memory and a large number of I/Os in an industrial-grade Stratix® V GX device. Its low-voltage core supply and robust thermal rating make it suitable for demanding board-level designs that require scalable programmable logic and reliable operation across broad temperature conditions.

This device is a fit for engineers and system designers building complex signal processing, networking, industrial control or SoC-prototyping applications that need significant on-chip resources and high pin count integration, while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEA5N2F45I3LG.