5SGXEA5N2F45I3G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 498 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N2F45I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 490,000 logic elements

The 5SGXEA5N2F45I3G is an industrial-grade Stratix V GX Field Programmable Gate Array (FPGA) offering a high-density programmable fabric and extensive I/O in a 1932-ball FCBGA package. As a member of the Stratix V GX family, the device is part of a series that provides high-performance logic, substantial on-chip memory capacity, and configurable transceiver options for demanding embedded and communications applications.

Key differentiators for this device include a large logic capacity, approximately 46 Mbits of embedded memory, 840 user I/Os, and operation over an industrial temperature range, making it suitable for designs that require significant programmable logic and robust thermal operating margins.

Key Features

  • Logic Capacity — 490,000 logic elements for implementing complex custom logic, state machines, and datapath acceleration.
  • Embedded Memory — Approximately 46 Mbits of on-chip RAM to support buffers, FIFOs, and scratchpad storage without external memory.
  • I/O Density — 840 user I/Os to accommodate wide parallel interfaces, high pin-count connectivity, and dense board-level integration.
  • Transceiver Options (series-level) — Stratix V GX family transceiver speed grades are defined in the datasheet and include GX channel options up to 14.1 Gbps (series-level specification).
  • Power Supply — Core voltage specified between 820 mV and 880 mV to match system power-rail planning and DC design.
  • Package & Mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45) for surface-mount PCB assembly.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for industrial applications and environments.
  • RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

  • High-density networking and switching — Large logic capacity and high I/O count support packet processing, interface bridging, and custom protocol implementation.
  • Signal processing and acceleration — Substantial on-chip RAM and extensive logic elements enable real-time datapath processing and hardware acceleration tasks.
  • Telecommunications and I/O convergence — The Stratix V GX family’s transceiver-grade options and dense I/O make it suitable for systems that combine multiple high-speed interfaces.

Unique Advantages

  • High programmable capacity: 490,000 logic elements provide a wide implementation envelope for complex algorithms and large-scale custom logic blocks.
  • Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependency on external memory for buffering and intermediate data storage.
  • Extensive I/O flexibility: 840 I/Os enable broad interface support and simplify board-level routing for multi-interface systems.
  • Industrial readiness: Specified operation from −40 °C to 100 °C addresses thermal margins required in many industrial deployments.
  • Compact, high-density package: 1932-ball FCBGA (45×45) package supports high pin counts in a condensed footprint for space-constrained designs.
  • Series-level transceiver capability: As part of the Stratix V GX family, the device benefits from defined transceiver speed grades in the series documentation, supporting high-speed serial link planning.

Why Choose 5SGXEA5N2F45I3G?

The 5SGXEA5N2F45I3G delivers a balance of large programmable logic capacity, sizable embedded memory, and very high I/O density in an industrial-grade Stratix V GX device. These characteristics make it well suited for designers who need to implement complex custom logic, large datapaths, or multi-interface systems while maintaining operation across broad temperature ranges.

This device is positioned for teams building demanding embedded, networking, or signal-processing systems that require scalability in logic resources and memory, along with broad connectivity. Its FCBGA package and defined core voltage range support integration into production-level PCBs with careful power and thermal planning.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEA5N2F45I3G and to discuss how this Stratix V GX FPGA can meet your design requirements.

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