5SGXEA5N2F45I2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 1,030 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N2F45I2L – Stratix® V GX FPGA IC (490,000 logic elements)

The 5SGXEA5N2F45I2L is a Stratix® V GX field-programmable gate array (FPGA) from Intel, delivering a high-density programmable fabric suitable for demanding, industrial-grade applications. This device combines a large logic capacity with substantial on-chip memory and a high I/O count to support complex digital designs.

Key hardware attributes include 490,000 logic elements, approximately 46.08 Mbits of embedded memory, 840 general-purpose I/Os, a surface-mount 1932-BBGA (FCBGA) package with a 45×45 mm supplier package, an industrial operating range of −40 °C to 100 °C, and a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant.

Key Features

  • Core Capacity  490,000 logic elements provide a high-capacity programmable fabric for large-scale logic implementation and complex system integration.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffers, state storage, and memory-hungry logic functions.
  • High I/O Count  840 I/O pins enable extensive external connectivity and support for wide parallel interfaces and dense board-level integration.
  • Package & Mounting  1932-BBGA (FCBGA) surface-mount package; supplier device package listed as 1932-FBGA, FC (45×45 mm) for high-pin-count, compact board footprint.
  • Power  Core voltage supply specified from 820 mV to 880 mV to match required FPGA core operating conditions.
  • Operating Temperature & Grade  Industrial-grade operation across −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Standards Compliance  RoHS compliant, supporting regulatory and environmental requirements.

Typical Applications

  • Industrial systems  High logic density and industrial temperature rating make this device suitable for control and automation platforms that demand reliability and long-term operation.
  • High-density digital processing  Large logic element count and substantial embedded memory support complex signal processing, protocol handling, and custom compute pipelines.
  • Board-level integration with dense I/O  With 840 I/Os and a high-pin-count FCBGA package, the device fits designs that require extensive peripheral and bus connectivity.

Unique Advantages

  • High logic density: 490,000 logic elements enable consolidation of large functions into a single FPGA, reducing system-level component count.
  • Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM minimizes external memory needs for many applications.
  • Extensive I/O capability: 840 I/Os provide flexibility for interfacing multiple subsystems and high-bandwidth data paths.
  • Industrial robustness: Rated for −40 °C to 100 °C operation to address industrial deployment requirements.
  • High-pin-count package: The 1932-BBGA (FCBGA) 45×45 mm package supports dense routing and compact board designs.
  • Regulatory compliance: RoHS compliant to meet environmental directives.

Why Choose 5SGXEA5N2F45I2L?

The 5SGXEA5N2F45I2L positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that require extensive logic resources, significant on-chip memory, and abundant I/O. Its combination of 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 840 I/Os enables consolidation of complex subsystems onto a single programmable device while supporting robust operation across a wide temperature range.

This device is appropriate for engineers and system designers targeting high-density digital processing, extensive board-level integration, and industrial deployments where on-chip resources and thermal tolerance are essential. Its form factor and compliance attributes make it a practical choice for production designs requiring RoHS conformance and surface-mount assembly.

If you would like pricing, availability, or a formal quote for 5SGXEA5N2F45I2L, please submit a request or inquiry to receive detailed commercial information and procurement support.

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