5SGXEA5N2F45I2L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,030 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5N2F45I2L – Stratix® V GX FPGA IC (490,000 logic elements)
The 5SGXEA5N2F45I2L is a Stratix® V GX field-programmable gate array (FPGA) from Intel, delivering a high-density programmable fabric suitable for demanding, industrial-grade applications. This device combines a large logic capacity with substantial on-chip memory and a high I/O count to support complex digital designs.
Key hardware attributes include 490,000 logic elements, approximately 46.08 Mbits of embedded memory, 840 general-purpose I/Os, a surface-mount 1932-BBGA (FCBGA) package with a 45×45 mm supplier package, an industrial operating range of −40 °C to 100 °C, and a core voltage supply range of 820 mV to 880 mV. The device is RoHS compliant.
Key Features
- Core Capacity 490,000 logic elements provide a high-capacity programmable fabric for large-scale logic implementation and complex system integration.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM to support large buffers, state storage, and memory-hungry logic functions.
- High I/O Count 840 I/O pins enable extensive external connectivity and support for wide parallel interfaces and dense board-level integration.
- Package & Mounting 1932-BBGA (FCBGA) surface-mount package; supplier device package listed as 1932-FBGA, FC (45×45 mm) for high-pin-count, compact board footprint.
- Power Core voltage supply specified from 820 mV to 880 mV to match required FPGA core operating conditions.
- Operating Temperature & Grade Industrial-grade operation across −40 °C to 100 °C for deployment in temperature-challenging environments.
- Standards Compliance RoHS compliant, supporting regulatory and environmental requirements.
Typical Applications
- Industrial systems High logic density and industrial temperature rating make this device suitable for control and automation platforms that demand reliability and long-term operation.
- High-density digital processing Large logic element count and substantial embedded memory support complex signal processing, protocol handling, and custom compute pipelines.
- Board-level integration with dense I/O With 840 I/Os and a high-pin-count FCBGA package, the device fits designs that require extensive peripheral and bus connectivity.
Unique Advantages
- High logic density: 490,000 logic elements enable consolidation of large functions into a single FPGA, reducing system-level component count.
- Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM minimizes external memory needs for many applications.
- Extensive I/O capability: 840 I/Os provide flexibility for interfacing multiple subsystems and high-bandwidth data paths.
- Industrial robustness: Rated for −40 °C to 100 °C operation to address industrial deployment requirements.
- High-pin-count package: The 1932-BBGA (FCBGA) 45×45 mm package supports dense routing and compact board designs.
- Regulatory compliance: RoHS compliant to meet environmental directives.
Why Choose 5SGXEA5N2F45I2L?
The 5SGXEA5N2F45I2L positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that require extensive logic resources, significant on-chip memory, and abundant I/O. Its combination of 490,000 logic elements, roughly 46 Mbits of embedded RAM, and 840 I/Os enables consolidation of complex subsystems onto a single programmable device while supporting robust operation across a wide temperature range.
This device is appropriate for engineers and system designers targeting high-density digital processing, extensive board-level integration, and industrial deployments where on-chip resources and thermal tolerance are essential. Its form factor and compliance attributes make it a practical choice for production designs requiring RoHS conformance and surface-mount assembly.
If you would like pricing, availability, or a formal quote for 5SGXEA5N2F45I2L, please submit a request or inquiry to receive detailed commercial information and procurement support.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018