5SGXEA5N2F45C3WN

The 5SGXEA5N2F45C3WN is a Stratix V GX field programmable gate array (FPGA) IC delivering high-density programmable logic and a large embedded memory footprint for complex digital designs. As a member of the Stratix V GX family, it pairs substantial logic capacity and on-chip RAM with a high I/O count and a large FCBGA package to address demanding communications, compute acceleration, and protocol-bridging applications.

Key Features

• Core logic capacity — 490,000 logic elements for implementing large-scale digital designs and complex state machines.
• Embedded memory — approximately 46.08 Mbits of on-chip RAM to support buffering, packet processing, and data-path storage.
• I/O density — 840 I/Os to support high-pin-count interfaces and multi-protocol connectivity.
• Transceiver capability (series) — Stratix V GX family transceiver speed grades are defined in the device datasheet (series-level support up to GX channel 14.1 Gbps as described in the Stratix V documentation).
• Power — Core voltage supply range 820 mV to 880 mV, enabling designs that follow the specified core operating window.
• Package and mounting — 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device.
• Commercial temperature grade — rated for operation from 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-speed communications — Series-level transceiver support in Stratix V GX devices enables use in networking and data-transport front ends that require high-bandwidth serial links.
• Compute acceleration — Large logic capacity and substantial on-chip RAM support hardware acceleration of compute kernels and data-path processing.
• Protocol bridging and I/O expansion — High I/O count accommodates multi-protocol interfacing, protocol conversion, and dense board-level connectivity.

Unique Advantages

• High logic density: 490,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing board-level complexity.
• Significant on-chip memory: approximately 46.08 Mbits of embedded RAM minimizes external memory dependencies for buffering and packet processing.
• Extensive I/O: 840 I/Os enable direct connection to numerous peripherals, transceivers, and external devices without intermediary logic.
• Compact, high-pin-count package: 1932-BBGA (FCBGA) in a 45×45 supplier footprint supports dense system integration while maintaining surface-mount assembly compatibility.
• Commercial temperature rating: 0 °C to 85 °C makes this device suitable for standard commercial environments and system-level deployments.
• RoHS compliant: Meets common lead-free and hazardous substance requirements for contemporary electronic manufacturing.

Why Choose 5SGXEA5N2F45C3WN?

The 5SGXEA5N2F45C3WN positions itself as a high-capacity Stratix V GX FPGA option for designs that require a combination of large programmable logic, significant on-chip memory, and a very high I/O count in a single-package solution. Its commercial-grade thermal range and RoHS compliance support mainstream product development and manufacturing flows.

Design teams targeting networking, compute acceleration, and dense interface applications will find the device’s logic density, embedded RAM, and package attributes useful for consolidating system functions and reducing board-level BOM. The device leverages Stratix V GX family characteristics to provide a scalable platform within that product series.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEA5N2F45C3WN Stratix V GX FPGA.