5SGXEA5N2F45I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 206 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5N2F45I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEA5N2F45I2G is a Stratix® V GX family Field Programmable Gate Array (FPGA) IC in an industrial temperature grade. It combines high logic density and large on‑chip memory with a high I/O count and is supplied in a 1932‑BBGA FCBGA package for surface‑mount assembly.
This device is intended for designs that require substantial programmable logic resources, significant embedded RAM, and broad I/O connectivity while operating across an industrial temperature range.
Key Features
- Core Logic 490,000 logic elements provide substantial programmable logic capacity for complex digital designs.
- Embedded Memory Approximately 46 Mbits of embedded memory (46,080,000 total RAM bits) for on‑chip buffering, scratchpad memory, and state storage.
- I/O Capacity 840 I/Os to support wide connectivity and multiple external interfaces.
- Power Supply Core voltage supply range from 870 mV to 930 mV for defined operating conditions.
- Package & Mounting 1932‑BBGA, FCBGA package (supplier device package: 1932‑FBGA, FC (45×45)); surface‑mount device for compact board integration.
- Operating Temperature & Grade Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for thermally demanding environments.
- Regulatory RoHS compliant.
Unique Advantages
- High logic density: 490,000 logic elements enable implementation of large, complex logic functions on a single device, reducing system partitioning.
- Large on‑chip memory: Approximately 46 Mbits of embedded RAM minimize external memory dependencies and improve data throughput for memory‑intensive algorithms.
- Extensive I/O: 840 I/Os provide flexibility for interfacing multiple peripherals, sensors, and high‑pin‑count subsystems without additional IO expander components.
- Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in industrial and ruggedized environments.
- Compact, high‑pin‑count package: 1932‑BBGA FCBGA packaging delivers high integration density in a surface‑mount form factor for space‑constrained PCBs.
Why Choose 5SGXEA5N2F45I2G?
The 5SGXEA5N2F45I2G delivers a combination of high logic capacity, significant embedded memory, and broad I/O that addresses demanding programmable logic applications requiring integration and reliability across temperature extremes. As a member of the Stratix V GX family, device electrical and switching characteristics are documented for system design and verification.
This part is suited for engineering teams building complex digital systems that need on‑chip resources to reduce external components, consolidate functionality, and maintain operation across industrial temperature ranges.
Request a quote or submit an inquiry to obtain pricing, availability, and support information for 5SGXEA5N2F45I2G.

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