5SGXEA5N2F45I2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 206 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N2F45I2G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA5N2F45I2G is a Stratix® V GX family Field Programmable Gate Array (FPGA) IC in an industrial temperature grade. It combines high logic density and large on‑chip memory with a high I/O count and is supplied in a 1932‑BBGA FCBGA package for surface‑mount assembly.

This device is intended for designs that require substantial programmable logic resources, significant embedded RAM, and broad I/O connectivity while operating across an industrial temperature range.

Key Features

  • Core Logic  490,000 logic elements provide substantial programmable logic capacity for complex digital designs.
  • Embedded Memory  Approximately 46 Mbits of embedded memory (46,080,000 total RAM bits) for on‑chip buffering, scratchpad memory, and state storage.
  • I/O Capacity  840 I/Os to support wide connectivity and multiple external interfaces.
  • Power Supply  Core voltage supply range from 870 mV to 930 mV for defined operating conditions.
  • Package & Mounting  1932‑BBGA, FCBGA package (supplier device package: 1932‑FBGA, FC (45×45)); surface‑mount device for compact board integration.
  • Operating Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C, suitable for thermally demanding environments.
  • Regulatory  RoHS compliant.

Unique Advantages

  • High logic density: 490,000 logic elements enable implementation of large, complex logic functions on a single device, reducing system partitioning.
  • Large on‑chip memory: Approximately 46 Mbits of embedded RAM minimize external memory dependencies and improve data throughput for memory‑intensive algorithms.
  • Extensive I/O: 840 I/Os provide flexibility for interfacing multiple peripherals, sensors, and high‑pin‑count subsystems without additional IO expander components.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in industrial and ruggedized environments.
  • Compact, high‑pin‑count package: 1932‑BBGA FCBGA packaging delivers high integration density in a surface‑mount form factor for space‑constrained PCBs.

Why Choose 5SGXEA5N2F45I2G?

The 5SGXEA5N2F45I2G delivers a combination of high logic capacity, significant embedded memory, and broad I/O that addresses demanding programmable logic applications requiring integration and reliability across temperature extremes. As a member of the Stratix V GX family, device electrical and switching characteristics are documented for system design and verification.

This part is suited for engineering teams building complex digital systems that need on‑chip resources to reduce external components, consolidate functionality, and maintain operation across industrial temperature ranges.

Request a quote or submit an inquiry to obtain pricing, availability, and support information for 5SGXEA5N2F45I2G.

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