5SGXEA5N2F45C3N

The 5SGXEA5N2F45C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1932-BBGA FCBGA package. It provides high logic capacity and substantial on-chip memory in a surface-mount, commercial-grade device designed for demanding programmable-logic implementations.

This device is intended for designs that require large logic resources, significant embedded RAM, and a high I/O count while operating within a commercial temperature range and a low-voltage core supply.

Key Features

• Core Logic  Up to 490,000 logic elements to support large-scale programmable logic and complex designs.
• Logic Array Capacity  Approximately 185,000 logic array blocks (as documented) to organize and structure logic resources.
• Embedded Memory  Approximately 46.08 Mbits of embedded RAM for on-chip buffering, state storage, and memory-intensive functions.
• I/O Density  Up to 840 I/O pins for high fanout connectivity and flexible board-level interfacing.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV to support low-voltage operation.
• Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45), surface-mount for compact board integration.
• Operating Range  Commercial temperature grade with an operating temperature of 0 °C to 85 °C.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic  For designs that require upwards of 490,000 logic elements and extensive on-chip RAM to implement large custom logic and state machines.
• I/O-intensive systems  Suitable for applications that need a high number of external interfaces, using the device’s 840 I/O capability.
• Embedded memory-centric designs  Use internal RAM (≈46.08 Mbits) for buffering, lookup tables, and data-intensive on-chip processing.

Unique Advantages

• Extensive logic capacity: 490,000 logic elements provide headroom for complex, multi-function designs without immediate partitioning across multiple devices.
• Large embedded RAM: Approximately 46.08 Mbits of on-chip memory reduces dependence on external memory components and simplifies board-level design.
• High I/O count: 840 I/O pins enable broad peripheral and interface support on a single device.
• Compact, high-density package: 1932-BBGA FCBGA (45×45) packaging allows dense integration while maintaining surface-mount compatibility.
• Low-voltage core operation: 0.820–0.880 V core supply supports low-power design considerations.
• Commercial-grade qualification: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic products.

Why Choose 5SGXEA5N2F45C3N?

The 5SGXEA5N2F45C3N positions itself as a high-capacity Stratix V GX FPGA option for engineers who need large programmable logic resources, substantial on-chip memory, and a high I/O count in a single, surface-mount FCBGA package. Its low-voltage core and commercial operating range make it suitable for robust, high-density designs where integration and board-level consolidation are priorities.

Choose this device when your design requires scalable logic and memory resources, broad external interfacing, and a compact package form factor—backed by Intel’s Stratix V GX device family specifications and RoHS compliance.

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