5SGXEA5N2F45C2LN

The 5SGXEA5N2F45C2LN is a Stratix® V GX field‑programmable gate array (FPGA) IC from Intel. It delivers large on‑chip logic and memory capacity in a high‑pin 1932‑ball FCBGA package targeted at commercial‑grade designs.

With 490,000 logic elements, approximately 46 Mbits of embedded memory, and 840 general‑purpose I/Os, this device is suited for designs that require dense logic integration, significant embedded RAM, and a high I/O count while operating within a commercial temperature range.

Key Features

• Core & Logic  490,000 logic elements (cells) for implementing large, complex digital designs.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support buffering, FIFOs, and local storage.
• I/O Capacity  840 user I/Os to interface with high‑pin-count systems and dense peripheral connectivity.
• Package & Mounting  1932‑BBGA (FCBGA) package, supplier package listed as 1932‑FBGA, FC (45×45); surface‑mount device.
• Power  Core supply voltage range of 820 mV to 880 mV for the device core rail.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital systems  Implement complex logic and state machines using the large pool of logic elements and embedded RAM.
• Network and communications hardware  High I/O count and Stratix V GX family heritage suit designs that need extensive external interfaces and data routing.
• Signal processing and acceleration  On‑chip memory and abundant logic resources enable local buffering and custom data‑path implementations.

Unique Advantages

• Large logic capacity: 490,000 logic elements provide the resource headroom for complex, multi‑function designs.
• Significant embedded memory: Approximately 46 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 840 user I/Os simplify connectivity to high‑pin subsystems and peripherals without multiplexing compromises.
• Compact, high‑pin package: 1932‑BBGA FCBGA package enables a dense implementation for board designs requiring many signals in a manageable footprint.
• Low core voltage range: 820–880 mV core supply supports designs targeting modern low‑voltage FPGA core rails.
• Commercial temperature rating: Rated for 0 °C to 85 °C suitable for a wide range of commercial electronics applications.

Why Choose 5SGXEA5N2F45C2LN?

The 5SGXEA5N2F45C2LN positions itself where large logic capacity, substantial embedded RAM, and a high I/O count are required within a commercial‑grade FPGA. Its 1932‑ball FCBGA package and surface‑mount format allow dense system integration while the core voltage range and RoHS compliance support modern board‑level power and environmental requirements.

This device is appropriate for engineering teams designing complex digital, network, or signal‑processing systems that need scalable on‑chip resources and a proven device family foundation as documented in the Stratix V GX device literature.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEA5N2F45C2LN and to discuss how it fits your next design.