5SGXEA5N2F45C2WN

The 5SGXEA5N2F45C2WN is a high-density Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It integrates approximately 490,000 logic elements and approximately 46.08 Mbits of embedded memory, providing significant on-chip resource capacity for complex hardware designs.

Packaged in a 1932-BBGA (FCBGA) footprint with a supplier package of 1932-FBGA, FC (45×45), this commercial-grade, surface-mount device features up to 840 I/O pins, a core supply voltage range of 870 mV to 930 mV, and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and is part of the Stratix V GX family documented in the Stratix V device datasheet.

Key Features

• High Logic Capacity  Approximately 490,000 logic elements to implement large, complex digital designs and custom hardware accelerators.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support data buffering, state storage, and LUT-based memory functions.
• Extensive I/O  Up to 840 I/O pins for dense external interfacing, multi-channel connectivity, and flexible board-level integration.
• Package Options  1932-BBGA (FCBGA) package with supplier device package listed as 1932-FBGA, FC (45×45) for high-pin-count, compact designs.
• Power Requirements  Core voltage supply range from 870 mV to 930 mV, enabling integration with regulated FPGA power rails.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial-environment electronic systems.
• Surface Mount  Designed for surface-mount assembly to support modern PCB manufacturing and assembly flows.
• RoHS Compliant  Meets RoHS requirements for restricted substances.

Typical Applications

• High-density logic designs  Systems that require substantial logic resources can leverage the device’s approximately 490,000 logic elements.
• Large on-chip buffering and memory  Applications needing significant embedded RAM capacity can use the device’s approximately 46.08 Mbits of on-chip memory.
• Dense external interfacing  Designs requiring many parallel or multiplexed interfaces can take advantage of up to 840 I/O pins.

Unique Advantages

• Large integrated resources: The combination of ~490k logic elements and ~46.08 Mbits of embedded memory reduces the need for external logic and memory, simplifying system design.
• High I/O density: Up to 840 I/O pins enable consolidation of multiple interfaces and peripherals on a single FPGA fabric.
• Compact, high-pin-count package: The 1932-BBGA (FCBGA) package provides a compact footprint while supporting a very high pin count for board-level integration.
• Commercial-grade operating range: Rated 0 °C to 85 °C and surface-mount compatible for mainstream electronic products and standard deployment environments.
• Standards-compliant supply and manufacturability: Defined core supply range (870 mV–930 mV) and RoHS compliance simplify power-system planning and environmental compliance.

Why Choose 5SGXEA5N2F45C2WN?

The 5SGXEA5N2F45C2WN delivers a compelling balance of logic density, embedded memory, and I/O capacity within a single Stratix V GX FPGA device. Its specification set—approximately 490,000 logic elements, approximately 46.08 Mbits of on-chip RAM, and up to 840 I/Os—makes it well suited to complex digital designs that demand large programmable fabric and dense external connectivity while remaining within standard commercial operating conditions.

As part of the Stratix V family from Intel, this device is documented in the Stratix V device datasheet and is intended for designs where high on-chip resource integration, board-level pin density, and compliance with standard manufacturing and environmental requirements are priorities.

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