5SGXEA5N2F45C2LG

The 5SGXEA5N2F45C2LG is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1932-BBGA FCBGA package. It provides large programmable logic capacity, substantial on-chip RAM, and a high I/O count for complex digital designs.

This device is suited to designs that require high-density programmable logic, significant embedded memory, and a large number of I/O connections while operating within commercial temperature ranges and a low-voltage core supply.

Key Features

• Core Logic  Approximately 490,000 logic elements suitable for large, complex FPGA designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, lookup tables, and algorithm state storage.
• I/O Density  Up to 840 I/O pins to support wide bus interfaces and numerous peripheral connections.
• Power Supply  Core supply voltage range of 820 mV to 880 mV to match low-voltage system architectures.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45); designed for surface-mount assembly.
• Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant for environmental and regulatory conformity.

Typical Applications

• High-density programmable logic systems  Use the large logic element count to implement complex state machines, datapaths, and custom accelerators.
• I/O-intensive platforms  High I/O count enables wide parallel interfaces, large peripheral arrays, and multi-channel connectivity.
• Memory-heavy processing  Substantial on-chip RAM supports buffering, packet queues, and on-chip data storage for algorithm implementations.
• Commercial embedded systems  Designed for integration into commercial-grade products operating within 0 °C to 85 °C.

Unique Advantages

• High programmable capacity: Approximately 490,000 logic elements provide the headroom needed for large-scale FPGA logic integration.
• Significant on-chip RAM: Approximately 46.08 Mbits of embedded memory reduces dependence on external RAM for many buffering and state-storage needs.
• Very high I/O count: 840 I/Os enable dense external connectivity and flexible partitioning of interfaces across the device.
• Compact FCBGA package: 1932-BBGA package provides a high-pin-count solution in a 45×45 form factor for space-constrained board designs.
• Low-voltage core support: Core supply between 820 mV and 880 mV aligns with modern low-voltage system designs.
• Manufacturer pedigree: Built as part of the Intel Stratix V GX family, leveraging established device architecture and documentation.

Why Choose 5SGXEA5N2F45C2LG?

The 5SGXEA5N2F45C2LG delivers a blend of large logic capacity, significant on-chip memory, and extensive I/O in a compact FCBGA package for commercial FPGA-based systems. Its specifications make it suitable for complex, high-density designs where on-chip resources and I/O bandwidth are critical.

This part is appropriate for engineering teams and procurement departments seeking a high-capacity Stratix V GX FPGA from Intel with RoHS compliance and commercial operating specifications.

Request a quote or submit a procurement inquiry for part 5SGXEA5N2F45C2LG to receive pricing and availability information.