5SGXEA5N2F45C3G

The 5SGXEA5N2F45C3G is a Stratix V GX family FPGA from Intel, offering large-scale programmable logic and on-chip memory in a high-density FCBGA package. This device is designed for applications that require extensive logic resources, high I/O counts, and the memory capacity common to Stratix V devices.

As a member of the Stratix V GX family, the device aligns with the series' electrical and switching characteristics documented in the Stratix V device datasheet and is supplied in a 1932-BBGA (45 × 45 mm) footprint for surface-mount assembly.

Key Features

• Core Logic Density  490,000 logic elements (cells) and 185,000 logic blocks provide substantial programmable logic capacity for complex architectures.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage within the FPGA fabric.
• I/O Capability  840 user I/O pins accommodate extensive external connectivity and multiple parallel interfaces.
• Power and Supply  Core voltage supply range specified at 820 mV to 880 mV to match the device's operating requirements.
• Package and Mounting  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC, 45 × 45 mm) optimized for surface-mount PCB assembly and compact system layouts.
• Operating Temperature  Commercial temperature grade rated from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliance  Device is RoHS compliant.
• Stratix V Series Characteristics  Part of the Stratix V family; refer to the Stratix V device documentation for detailed electrical characteristics, transceiver and I/O timing options, and speed-grade information.

Typical Applications

• High‑density programmable systems  Use the large logic and embedded memory resources for complex hardware acceleration and custom datapath implementations.
• High‑I/O aggregation  Large I/O count enables integration of multiple parallel interfaces and high‑port-count connectivity on a single device.
• Board‑level consolidation  Combine multiple functions in one FPGA to reduce component count and simplify board designs where compact FCBGA packaging is required.

Unique Advantages

• High programmable capacity: The combination of 490,000 logic elements and extensive on-chip RAM enables implementation of large, complex designs without external memory for many functions.
• Extensive external connectivity: 840 I/O pins allow direct interfacing to numerous peripherals and parallel buses, reducing external multiplexing or I/O expansion needs.
• Compact, manufacturable package: 1932-FCBGA surface-mount package supports dense PCB layouts and is suitable for production assembly processes.
• Commercial temperature support: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• Standards‑aligned supply range: Documented core voltage range (820 mV–880 mV) provides clear power design parameters for supply sequencing and regulation.
• Regulatory compliance: RoHS compliance simplifies environmental and regulatory planning for product builds.

Why Choose 5SGXEA5N2F45C3G?

The 5SGXEA5N2F45C3G positions itself as a high‑density Stratix V GX FPGA option for designs demanding substantial logic, memory, and I/O resources in a single device. Its defined voltage and temperature ratings, combined with the documented Stratix V series electrical characteristics, make it suitable for commercial products that require predictable power and thermal envelopes.

Engineers targeting consolidation of complex functions, implementing large datapaths, or integrating many external interfaces will find the device's density and package advantageous. The product is supported by Stratix V family documentation from the manufacturer to assist in system integration and electrical compliance checks.

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