5SGXEA5N2F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 809 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N2F45C2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

The 5SGXEA5N2F45C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering high logic density and substantial on-chip memory in a high-pin-count BGA package. It is designed for applications that require large numbers of logic elements, abundant embedded RAM, and extensive I/O connectivity within a commercial temperature range.

Key Features

  • Core Logic  Approximately 490,000 logic elements to implement complex programmable logic and custom functions.
  • Embedded Memory  Approximately 46.08 Mbits of on-chip RAM for buffering, state storage, and data-oriented functions.
  • I/O Density  840 user I/O pins to support wide bus interfaces, parallel data paths, and rich external connectivity.
  • Package and Mounting  1932-BBGA (FCBGA) supplier device package (1932-FBGA, FC 45×45) with surface-mount mounting for high-pin-count system integration.
  • Power  Core voltage supply range specified at 870 mV to 930 mV for the device core.
  • Operating Temperature & Grade  Commercial grade device rated for 0°C to 85°C operation.
  • Standards Compliance  RoHS-compliant construction.

Typical Applications

  • High-density programmable logic  Implements complex custom logic, data-path processing, and control functions that require large logic element counts and substantial embedded memory.
  • Networking and communications systems  Supports designs that need extensive I/O and high-performance programmable resources for protocol processing and interface aggregation.
  • Signal processing and acceleration  Provides on-chip memory and logic density suited for real-time processing, buffering, and algorithm acceleration.
  • System integration and prototyping  High I/O count and dense logic make the device suitable for prototype platforms and integrated system designs that consolidate multiple functions.

Unique Advantages

  • High logic capacity: Approximately 490,000 logic elements enable large-scale designs and complex implementations without partitioning across devices.
  • Significant embedded memory: Approximately 46.08 Mbits of on-chip RAM supports buffering, FIFOs, and working memory for data-intensive tasks.
  • Extensive I/O: 840 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and high-pin-count system interconnects.
  • Compact, high-pin-count package: 1932-BBGA (FCBGA) packaging allows dense routing and integration in systems requiring many signals.
  • Commercial-grade operation: Rated for 0°C to 85°C, suitable for standard commercial environment deployments.
  • Low-voltage core support: Core supply range of 870 mV to 930 mV aligns with modern low-voltage power architectures.

Why Choose 5SGXEA5N2F45C2N?

The 5SGXEA5N2F45C2N positions itself as a high-density Stratix V GX FPGA option for designers who need a combination of large logic resources, substantial embedded RAM, and a high I/O count in a single commercial-grade package. Its specification set makes it appropriate for complex programmable systems, communications equipment, and signal-processing applications where integration and resource availability matter.

Backed by Intel’s Stratix V documentation and delivered in a 1932-BBGA FCBGA package, this device is suited for engineering teams focused on scalable, high-capacity FPGA implementations while leveraging a commercially supported product family.

Request a quote or submit a purchase inquiry to evaluate the 5SGXEA5N2F45C2N for your next high-density FPGA design.

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