5SGXEA5N2F45C2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 809 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5N2F45C2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA
The 5SGXEA5N2F45C2N is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, delivering high logic density and substantial on-chip memory in a high-pin-count BGA package. It is designed for applications that require large numbers of logic elements, abundant embedded RAM, and extensive I/O connectivity within a commercial temperature range.
Key Features
- Core Logic Approximately 490,000 logic elements to implement complex programmable logic and custom functions.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM for buffering, state storage, and data-oriented functions.
- I/O Density 840 user I/O pins to support wide bus interfaces, parallel data paths, and rich external connectivity.
- Package and Mounting 1932-BBGA (FCBGA) supplier device package (1932-FBGA, FC 45×45) with surface-mount mounting for high-pin-count system integration.
- Power Core voltage supply range specified at 870 mV to 930 mV for the device core.
- Operating Temperature & Grade Commercial grade device rated for 0°C to 85°C operation.
- Standards Compliance RoHS-compliant construction.
Typical Applications
- High-density programmable logic Implements complex custom logic, data-path processing, and control functions that require large logic element counts and substantial embedded memory.
- Networking and communications systems Supports designs that need extensive I/O and high-performance programmable resources for protocol processing and interface aggregation.
- Signal processing and acceleration Provides on-chip memory and logic density suited for real-time processing, buffering, and algorithm acceleration.
- System integration and prototyping High I/O count and dense logic make the device suitable for prototype platforms and integrated system designs that consolidate multiple functions.
Unique Advantages
- High logic capacity: Approximately 490,000 logic elements enable large-scale designs and complex implementations without partitioning across devices.
- Significant embedded memory: Approximately 46.08 Mbits of on-chip RAM supports buffering, FIFOs, and working memory for data-intensive tasks.
- Extensive I/O: 840 I/O pins provide flexibility for wide parallel interfaces, multiple peripherals, and high-pin-count system interconnects.
- Compact, high-pin-count package: 1932-BBGA (FCBGA) packaging allows dense routing and integration in systems requiring many signals.
- Commercial-grade operation: Rated for 0°C to 85°C, suitable for standard commercial environment deployments.
- Low-voltage core support: Core supply range of 870 mV to 930 mV aligns with modern low-voltage power architectures.
Why Choose 5SGXEA5N2F45C2N?
The 5SGXEA5N2F45C2N positions itself as a high-density Stratix V GX FPGA option for designers who need a combination of large logic resources, substantial embedded RAM, and a high I/O count in a single commercial-grade package. Its specification set makes it appropriate for complex programmable systems, communications equipment, and signal-processing applications where integration and resource availability matter.
Backed by Intel’s Stratix V documentation and delivered in a 1932-BBGA FCBGA package, this device is suited for engineering teams focused on scalable, high-capacity FPGA implementations while leveraging a commercially supported product family.
Request a quote or submit a purchase inquiry to evaluate the 5SGXEA5N2F45C2N for your next high-density FPGA design.

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