5SGXEA5N2F45C2L

The 5SGXEA5N2F45C2L is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering high-density programmable logic for complex digital designs. This commercial-grade device integrates 490,000 logic elements and approximately 46 Mbits of on-chip RAM to support sizeable logic and memory requirements.

Packaged in a 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) with surface-mount assembly, the device provides up to 840 I/Os and operates from a core supply range of 820 mV to 880 mV within a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  490,000 logic elements for implementing large-scale programmable logic and complex algorithms.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
• I/O Density  Up to 840 I/Os to interface with high-pin-count peripherals, parallel buses, and system I/O requirements.
• High-speed Transceiver Capability  Stratix V GX family devices include GX transceiver channels with speed grades that can support up to 14.1 Gbps (speed-grade dependent), as documented in the Stratix V device datasheet.
• Power  Core voltage supply range of 820 mV to 880 mV for compatibility with low-voltage FPGA power architectures.
• Package & Mounting  1932-BBGA, FCBGA package (supplier: 1932-FBGA, FC 45×45) optimized for surface-mount PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Use the large logic capacity and embedded RAM to implement complex pipelines, custom accelerators, and parallel processing engines.
• High-speed interfaces and networking  Leverage the GX transceiver family capability and 840 I/Os for data-paths, protocol bridging, and high-throughput link aggregation (transceiver speeds are speed-grade dependent).
• Telecommunications and datacom modules  Combine high logic count and on-chip memory for packet processing, framing, and interface adaptation functions.
• System integration and prototyping  The device’s high I/O count and dense logic make it suitable for consolidating multiple functions onto a single FPGA during system development and integration.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of large, complex designs without immediate migration to multi-device solutions.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O accessibility: Up to 840 I/Os support rich peripheral connectivity and parallel interfaces, simplifying board-level design.
• Family-level transceiver capability: Stratix V GX devices document GX channels with multi-gigabit capability (up to 14.1 Gbps, speed-grade dependent), enabling high-bandwidth links where required.
• Compact, industry-standard packaging: 1932-BBGA (45×45 mm supplier footprint) provides a high-pin-count solution in a surface-mount form factor.
• Regulatory and assembly readiness: RoHS compliance and standard surface-mount packaging support modern manufacturing and environmental requirements.

Why Choose 5SGXEA5N2F45C2L?

The 5SGXEA5N2F45C2L positions itself as a high-density Stratix V GX FPGA option for designs that require substantial programmable logic, sizeable on-chip memory, and a large number of I/Os. Its package and power envelope suit complex board-level integrations where a single FPGA can consolidate multiple subsystems.

Engineers and procurement teams targeting commercial-temperature applications will find the device’s combination of logic resources, embedded memory, and documented Stratix V GX transceiver capabilities useful for scalable designs that may evolve across speed-grade and feature requirements within the Stratix V family.

Request a quote or submit a brief inquiry to begin evaluating the 5SGXEA5N2F45C2L for your next design and to obtain pricing and availability information.