5SGXEA5N2F45I2N

The 5SGXEA5N2F45I2N is an Intel Stratix® V GX field-programmable gate array (FPGA) offered in an industrial temperature grade. It delivers high logic density, substantial on-chip memory, and a large number of user I/O in a 1932-ball BGA package suitable for surface-mount assembly.

This device targets designs that require a combination of large programmable logic capacity, significant embedded memory, and broad I/O support while operating over an industrial temperature range and low core voltage window.

Key Features

• High logic capacity — Approximately 490,000 logic elements to implement large-scale digital designs and complex IP.
• Embedded memory — Approximately 46 Mbits of on-chip RAM for buffers, FIFOs, and user memory arrays.
• Extensive I/O — 840 user I/Os to support wide parallel interfaces, multi-lane buses, and large mezzanine connectivity.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for demanding environments.
• Low-voltage core — Core supply specified between 870 mV and 930 mV, enabling optimized power delivery for core logic.
• Package and mounting — 1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), designed for surface-mount PCB assembly.
• Compliance — RoHS-compliant device for environmentally conscious designs.

Typical Applications

• High-density digital processing — Use the large logic element count and embedded memory to implement complex compute pipelines and custom accelerators.
• Communications and networking — Leverage abundant I/O and memory for packet processing, interface bridging, and protocol engines.
• Industrial control and automation — Industrial temperature rating and robust I/O count support sensor aggregation, motor control logic, and machine control systems.

Unique Advantages

• Scalable programmable capacity: Around 490,000 logic elements provide headroom for multi-function designs and future feature growth.
• On-chip memory for real-time data: Approximately 46 Mbits of embedded RAM reduces external memory dependence and shortens latency for buffering and streaming tasks.
• High I/O density: 840 user I/Os enable large parallel interfaces and flexible board-level connectivity without complex multiplexing.
• Industrial reliability: −40 °C to 100 °C operating range supports deployment in temperature-variable environments.
• Compact BGA packaging: 1932-BBGA (45×45) package offers a high pin-count solution in a compact footprint for space-constrained systems.
• Regulatory readiness: RoHS compliance supports environmental requirements for modern electronics manufacturing.

Why Choose 5SGXEA5N2F45I2N?

The 5SGXEA5N2F45I2N combines substantial programmable logic, ample embedded memory, and a large complement of I/Os in a surface-mount 1932-BBGA package, addressing designs that demand integration and scalability. Its industrial temperature rating and defined core-voltage range make it suitable for robust embedded and infrastructure applications where environmental range and power control are important design considerations.

Engineers selecting this Intel Stratix V GX device benefit from a device profile oriented toward large, complex designs that require on-chip resources and high I/O counts while maintaining compliance with RoHS and industrial operating conditions.

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