5SGXEA5N2F45I3LN

The 5SGXEA5N2F45I3LN is a Stratix V GX series Field Programmable Gate Array (FPGA) offered by Intel. It delivers a very large programmable fabric with high I/O density and substantial on-chip memory, packaged in a 1932-ball BGA for surface-mount applications.

Designed for high-density digital designs, this device targets applications that require hundreds of thousands of logic elements, large embedded memory (approximately 46.08 Mbits), and broad I/O connectivity while operating across an industrial temperature range.

Key Features

• Core capacity — 490,000 logic elements supporting complex, highly parallel designs; reported 185,000 logic blocks provide a measure of internal structure and resource partitioning.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM for buffer, cache, and storage of intermediate data.
• I/O density — 840 I/O pins to support large peripheral arrays, multi-channel interfaces, and extensive board-level connectivity.
• Power — Core voltage supply range from 820 mV to 880 mV, enabling defined power-supply design for the core logic.
• Package & mounting — 1932-ball BGA (FCBGA) package, supplier package listed as 1932-FBGA FC (45×45); surface-mount mounting type for board-level integration.
• Temperature & grade — Industrial grade with operating range from −40 °C to 100 °C for demanding thermal environments.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Large logic capacity and substantial embedded RAM enable complex FPGA-based compute, signal processing, and parallel algorithms.
• Multi-channel I/O systems — High I/O count suits designs requiring many interfaces, sensor arrays, or board-level channel expansion.
• Industrial systems — Industrial temperature grade supports deployment in control and automation environments that require extended operating temperature range.
• High-speed communications (series capability) — Stratix V GX series documentation references transceiver speed-grade options for designs that incorporate high-speed serial links.

Unique Advantages

• Substantial programmable fabric: 490,000 logic elements provide headroom for large-scale FPGA logic integration without immediate need for external logic devices.
• Large embedded memory: Approximately 46.08 Mbits of on-chip RAM reduces dependency on external memory for many buffering and temporary storage tasks.
• High I/O count: 840 I/Os allow dense external connectivity and flexible partitioning of peripherals and interfaces on a single device.
• Industrial operating range: Rated from −40 °C to 100 °C to meet the thermal needs of robust, field-deployed systems.
• Compact BGA package: 1932-ball FCBGA (45×45) enables integration of the device into space-constrained PCBs while supplying extensive pinout.
• Regulatory readiness: RoHS compliance supports environmentally conscious product design and supply-chain requirements.

Why Choose 5SGXEA5N2F45I3LN?

The 5SGXEA5N2F45I3LN positions itself as a high-capacity Stratix V GX FPGA choice for designs that need extensive logic resources, significant on-chip RAM, and a large number of I/Os in an industrial-grade package. Its defined core voltage range and robust thermal rating make it suitable for demanding embedded and infrastructure designs that prioritize integration and long-term deployment.

For engineering teams building complex digital systems, communications front-ends (leveraging GX series transceiver capabilities described in the device documentation), or dense I/O applications, this device delivers measurable resource density and package-level connectivity while maintaining regulatory compliance for RoHS-directed designs.

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