5SGXEA5N2F45I3N

The 5SGXEA5N2F45I3N is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It delivers a high density of programmable logic with 490,000 logic elements and approximately 46.08 Mbits of embedded memory, targeting complex, logic- and memory-intensive designs.

With up to 840 user I/Os, a compact 1932-BBGA FCBGA package, and a low-voltage core supply range of 820 mV to 880 mV, this device is well suited to designs that require dense integration, high I/O count, and extended operating temperature capability.

Key Features

• Core Logic  490,000 logic elements for implementing complex programmable logic and custom architectures.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage without external memory.
• I/O Density  Up to 840 user I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Power  Core voltage supply range of 820 mV to 880 mV for compatibility with modern low-voltage system rails.
• Package & Mounting  1932-BBGA (FCBGA) supplier device package 1932-FBGA, FC (45×45), designed for surface-mount assembly.
• Temperature Range  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density programmable systems  Designs that require large amounts of logic and on-chip memory can use the 490,000 logic elements and ~46.08 Mbits of RAM to implement complex algorithms and data paths.
• I/O‑intensive equipment  Systems that require extensive parallel signaling or many interfaces can take advantage of up to 840 user I/Os for flexible connectivity.
• Industrial embedded controllers  Applications requiring extended temperature operation (−40 °C to 100 °C) and surface-mount packaging benefit from this industrial-grade Stratix V GX device.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable complex gateware and high-function-count designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory and simplifies board design for buffering and local storage.
• High I/O count: Up to 840 I/Os supports broad interface requirements, simplifying integration of multi-channel systems and parallel buses.
• Industrial temperature capability: Specified operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Compact, surface-mount package: 1932-BBGA (45×45) package delivers high pin count in a space-efficient form factor for dense PCB layouts.
• Regulatory alignment: RoHS compliance supports use in regulated manufacturing processes.

Why Choose 5SGXEA5N2F45I3N?

The 5SGXEA5N2F45I3N positions itself as a high-density, industrial-grade Stratix V GX FPGA suited for designs that demand large programmable logic capacity, significant on-chip memory, and extensive I/O. Its combination of 490,000 logic elements, approximately 46.08 Mbits of embedded RAM, and up to 840 I/Os enables consolidation of complex functions into a single device, reducing BOM complexity and board area.

This device is appropriate for engineering teams developing high‑function FPGA solutions that require robust temperature performance and compact, surface-mount packaging. The defined core voltage range and RoHS compliance further simplify system-level integration and manufacturing considerations.

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