5SGXEA5N2F45I3L

The 5SGXEA5N2F45I3L is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in an industrial temperature grade. It delivers large programmable logic capacity and extensive I/O in a high-density FCBGA package for demanding embedded and communications applications.

Designed as part of the Stratix V GX family, the device provides abundant on-chip memory and I/O resources, a low-voltage core supply range, and support for Stratix V transceiver speed grades as documented in the device datasheet.

Key Features

• Logic Capacity  Approximately 490,000 logic elements to implement complex custom logic and large-scale designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, packet processing, and on-chip data storage.
• I/O Resources  840 I/O pins to enable high-connectivity designs and dense external interfacing.
• Transceiver Support (Stratix V GX family)  Stratix V GX devices include transceiver speed-grade options documented in the datasheet (up to 14.1 Gbps in applicable GX grades), enabling high-bandwidth serial links where required.
• Power and Core Voltage  Core voltage supply range of 820 mV to 880 mV to match system power delivery requirements for Stratix V devices.
• Package  1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor for compact board-level integration.
• Temperature and Grade  Industrial temperature range from –40 °C to 100 °C and industrial grade designation for deployment in temperature-demanding environments.
• RoHS Compliance  RoHS compliant to support environmental restriction requirements.

Typical Applications

• High‑speed communications and networking  Supports designs that require large logic fabrics, abundant memory, and Stratix V GX transceiver speed grades for high-bandwidth serial links.
• Signal processing and FPGA acceleration  Large logic capacity and on-chip RAM enable implementation of complex DSP pipelines and custom accelerators.
• Prototyping and system integration  High I/O count and dense logic resources make the device suitable for large prototype boards and system-level integration.
• Test and measurement equipment  Industrial temperature rating and plentiful I/O allow deployment in instrument and test systems operating across wide temperature ranges.

Unique Advantages

• High logic density: Approximately 490,000 logic elements let you implement large, complex designs on a single device, reducing the need for multi‑device solutions.
• Substantial embedded memory: Around 46 Mbits of on-chip RAM supports deep buffering and stateful processing without reliance on external memory.
• Extensive I/O connectivity: 840 I/Os provide flexible interfacing options for high-pin-count systems and dense peripheral connectivity.
• Industrial temperature capability: Rated from –40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact high-density package: 1932-BBGA FCBGA package enables high integration density on modern PCBs while remaining surface-mount compatible.
• Documented Stratix V GX transceiver options: Family-level transceiver speed grades are provided in the Stratix V datasheet for high-bandwidth serial link designs.

Why Choose 5SGXEA5N2F45I3L?

The 5SGXEA5N2F45I3L sits in the Stratix V GX family to deliver a balance of large programmable logic capacity, significant embedded memory, and high I/O density in a single industrial-grade FCBGA package. It is suited to engineers implementing complex, high-throughput designs that require on-chip resources and robust temperature performance.

Backed by Intel/Altera Stratix V device documentation, this part is appropriate for teams seeking scalable FPGA resources with clear electrical and timing characteristics documented in the device datasheet.

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