5SGXEA7K2F40C2G

The 5SGXEA7K2F40C2G is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1517-BBGA FCBGA package. It provides high logic capacity, substantial on-chip memory, and a large I/O count in a surface-mount package for commercial-temperature applications.

This device is suited to designs that require dense programmable logic and significant embedded memory while operating within a commercial temperature range and a low-voltage core supply.

Key Features

• Core Logic  Approximately 622,000 logic elements to implement large-scale programmable logic and custom data-paths.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet engines, and local data storage.
• I/O Capacity  696 user I/O pins to accommodate wide parallel interfaces and diverse peripheral connectivity.
• Package & Mounting  1517-BBGA, FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board designs.
• Power  Core supply range from 870 mV to 930 mV to match low-voltage system domains.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant.
• Series-Level Transceiver Options  Stratix V GX devices are offered in -1, -2, and -3 transceiver speed grades per the Stratix V device datasheet (see the series documentation for transceiver-level specifications).

Typical Applications

• High-density programmable logic systems  Designs that require large logic capacity and substantial on-chip RAM for complex algorithms and custom datapaths.
• High-I/O interface platforms  Systems that need a high count of general-purpose I/O for parallel buses, wide data interfaces, or multiple peripherals.
• Commercial embedded systems  Products operating within 0 °C to 85 °C that benefit from a high-capacity FPGA in a compact FCBGA package.

Unique Advantages

• High logic density:  Approximately 622,000 logic elements enable implementation of complex logic and large-scale custom functions on a single device.
• Substantial on-chip memory:  Around 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O:  696 I/O pins provide flexibility for interfacing to multiple peripherals and wide data buses without external multiplexing.
• Low-voltage core operation:  870 mV–930 mV core supply supports integration with low-voltage power rails and power-optimized designs.
• Compact, surface-mount package:  1517-BBGA (1517-FBGA, 40×40) packaging delivers a high-pin-count solution in a compact footprint for dense PCB layouts.
• Commercial temperature rating:  0 °C to 85 °C operation for mainstream embedded and communications equipment.

Why Choose 5SGXEA7K2F40C2G?

The 5SGXEA7K2F40C2G combines a high logic element count, substantial embedded memory, and a large I/O complement in a compact FCBGA package—making it suitable for commercial systems that require significant programmable resources within a defined temperature range. Its low-voltage core operation and RoHS compliance further align it with contemporary embedded design requirements.

For designs that demand dense programmable logic, sizable on-chip RAM, and broad I/O availability while adhering to commercial temperature specifications, this Stratix V GX device provides a verifiable hardware foundation backed by the Stratix V series documentation.

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