5SGXEB5R2F40I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40) |
|---|---|
| Quantity | 1,795 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R2F40I2N – Stratix® V GX Field Programmable Gate Array (FPGA) 1517-FBGA (40×40)
The 5SGXEB5R2F40I2N is an industrial-grade Stratix V GX FPGA from Intel, supplied in a 1517‑FBGA (40×40) surface-mount package. It delivers high-density programmable logic and on-chip memory for complex digital designs that require large I/O counts and robust operating margins.
Key on-board resources include approximately 490,000 logic elements, roughly 42 Mbits of embedded RAM, and 432 dedicated I/O pins. The device is specified for an operating voltage range of 870 mV to 930 mV and an industrial temperature range of –40 °C to 100 °C.
Key Features
- High-density logic: Approximately 490,000 logic elements for large-scale, compute-intensive designs and deep logic stacking.
- Embedded memory: Approximately 42 Mbits of on-chip RAM to support data buffering, state machines, and high-throughput processing without reliance on external memory.
- I/O capacity: 432 user I/O pins to support wide parallel interfaces, multi-lane I/O, and diverse board-level connectivity.
- Package & mounting: 1517‑FBGA (40×40) surface-mount package optimized for dense board layouts and thermal coupling to PCB.
- Power and core supply: Core voltage supply specified between 870 mV and 930 mV to match power delivery designs and regulator selection.
- Industrial temperature grade: Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- RoHS compliant: Conforms to RoHS requirements for lead-free manufacturing and assembly.
- Series-level transceiver capability: Stratix V GX series documentation specifies high-speed GX transceiver channel support (series-level data for transceiver speeds is available in the device datasheet).
Typical Applications
- High-speed communications: Large logic density and series-level GX transceiver capability enable implementation of networking and packet-processing functions that require substantial programmable logic and I/O.
- Data acceleration and compute: High logic element count and substantial on-chip RAM support custom acceleration engines and data-path implementations.
- Industrial systems: Industrial temperature rating and robust package make this device appropriate for demanding embedded and industrial control applications requiring extended temperature operation.
- Signal processing and instrumentation: Large memory and I/O resources facilitate complex signal-processing pipelines and multi-channel data acquisition designs.
Unique Advantages
- Large programmable fabric: Approximately 490,000 logic elements provide headroom for complex algorithms, multi-function designs, or consolidating multiple functions into a single device.
- Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory and improves latency for internal buffering and streaming applications.
- High I/O availability: 432 I/O pins enable broad interfacing options and high-bandwidth parallel connectivity without external expanders.
- Industrial-ready thermal range: Specified for –40 °C to 100 °C operation to meet the needs of industrial deployments and harsh-environment applications.
- Compact BGA footprint: 1517‑FBGA (40×40) offers a balance of pin count and board-area efficiency for dense multi-layer designs.
- Standards-conscious manufacturing: RoHS compliance supports modern assembly and environmental requirements.
Why Choose 5SGXEB5R2F40I2N?
The 5SGXEB5R2F40I2N brings the Stratix V GX series' high-density logic and memory resources to industrial applications that require large-scale programmable resources, extensive I/O, and wide operating temperature range. Its combination of approximately 490,000 logic elements, roughly 42 Mbits of embedded RAM, and 432 I/Os in a 1517‑FBGA package offers a compact yet capable foundation for advanced FPGA-based systems.
This device is suitable for engineers and teams building compute- and data-intensive FPGA designs that demand significant on-chip resources and industrial temperature operation. The documented series-level transceiver capabilities and the device's power and package specifications provide clear design parameters for power delivery, thermal planning, and system integration.
Request a quote or submit an inquiry to get pricing, availability, and ordering information for 5SGXEB5R2F40I2N. Our team can provide configuration, lead-time, and support details to help you move your design forward.

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