5SGXEB5R2F40I3LG

The 5SGXEB5R2F40I3LG is an Intel Stratix V GX field programmable gate array (FPGA) supplied in a 1517-FBGA (40×40) package for surface-mount applications. It delivers very large logic capacity, plentiful embedded RAM, and a high I/O count for complex digital systems. Designed for industrial-grade deployments, the device targets high-density system logic, signal processing, and high-pin-count interface consolidation.

Key Features

• Logic Capacity  Approximately 490,000 logic elements for large-scale FPGA designs and complex custom logic implementations.
• Embedded Memory  Approximately 42 Mbits of embedded RAM to support buffering, large lookup tables, and state storage on-chip.
• High I/O Count  432 user I/O pins to simplify system partitioning and reduce external interface components.
• Power Supply  Core voltage range specified at 820 mV to 880 mV for precise core power design and regulation.
• Package & Mounting  1517-FBGA (40×40) ball grid array in a surface-mount format for compact board integration.
• Industrial Temperature Grade  Qualified for operation from –40 °C to 100 °C for deployment in industrial environments.
• Standards & Compliance  RoHS compliant to support environmentally conscious design and supply chains.
• Family Characteristics  Stratix V GX devices are offered across commercial and industrial speed grades; the Stratix V family supports a range of transceiver speed grades depending on selected device and speed option.

Typical Applications

• High-density digital processing  Implement complex algorithms, DSP functions, or custom accelerators utilizing the device's large logic and embedded RAM resources.
• Interface consolidation  Replace multiple discrete interface ICs by leveraging the high I/O count to integrate diverse peripheral and bus connections on a single FPGA.
• Industrial control and automation  Deploy in industrial equipment where extended temperature range and industrial-grade qualification are required for reliable operation.
• High-throughput data buffering  Use embedded RAM for packet buffering, streaming data handling, and intermediate storage in system pipelines.

Unique Advantages

• Large integration scale: 490,000 logic elements reduce the need for multiple FPGAs or external glue logic, simplifying board-level design.
• Substantial on-chip memory: Approximately 42 Mbits of embedded RAM supports dense state machines, FIFOs, and data buffering without external memory.
• Rich I/O resource: 432 I/Os help minimize external interface components and routing complexity for high-pin-count systems.
• Industrial robustness: Rated for –40 °C to 100 °C operation to meet the thermal requirements of industrial deployments.
• Compact package: 1517-FBGA (40×40) ball grid array optimizes board area while providing high pin density for complex designs.
• Regulatory compliance: RoHS compliance supports eco-conscious product development and regulatory alignment.

Why Choose 5SGXEB5R2F40I3LG?

The 5SGXEB5R2F40I3LG combines very large logic capacity, substantial on-chip memory, and a high I/O count in a compact FBGA package, making it well suited for demanding industrial and high-density FPGA applications. Its industrial temperature rating and RoHS compliance make it a practical choice for designs requiring both performance and environmental consideration.

Engineers and system designers seeking to consolidate interfaces, implement complex custom logic, or deploy robust processing engines will find this Stratix V GX device appropriate for scalable designs backed by the Stratix V family characteristics and documentation.

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