5SGXEB5R2F43C1G

The 5SGXEB5R2F43C1G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, I/O‑rich digital implementations. It combines a large logic fabric with substantial on‑chip memory and a high I/O count to support complex, performance‑oriented designs.

Key value propositions include extensive logic capacity (490,000 logic elements), approximately 42 Mbits of embedded memory, and a 600‑pin I/O footprint in a 1760‑FCPGA package — enabling compact board integration while supporting demanding system partitioning and interfacing needs.

Key Features

• Logic Capacity — 490,000 logic elements for large-scale combinational and sequential logic implementation.
• Embedded Memory — Approximately 42 Mbits of on‑chip RAM to support buffering, state storage, and algorithm acceleration.
• I/O Density — 600 user I/Os to connect a wide range of peripherals, memory interfaces, and external logic.
• Package — 1760‑FCBGA (42.5 × 42.5 mm) supplier device package for high pin count in a single, surface‑mount footprint.
• Power — Core voltage supply specified from 870 mV to 930 mV to match system power‑rail planning requirements.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• RoHS Compliance — RoHS‑compliant construction for regulatory and manufacturing alignment.

Typical Applications

• High‑performance networking — Large logic resources and high I/O count allow implementation of packet processing, switching, and protocol offload functions.
• Data center acceleration — Substantial embedded memory and logic capacity enable hardware acceleration for compute and storage tasks.
• Broadcast and video processing — On‑chip RAM and dense logic support multi‑channel video pipelines, real‑time processing, and format conversion.
• High‑speed communications — Extensive I/O and large logic fabric facilitate complex protocol handling and interface bridging in communication systems.

Unique Advantages

• High integration density: 490,000 logic elements reduce the need for multiple devices when consolidating complex functions.
• Large on‑chip memory: Approximately 42 Mbits of embedded RAM minimizes external memory dependence and simplifies board design.
• Extensive external interfacing: 600 I/Os support broad peripheral connectivity and high fan‑out system architectures.
• Compact, manufacturable package: 1760‑FCBGA (42.5 × 42.5 mm) delivers high pin count in a surface‑mount form factor suited to dense PCB layouts.
• Commercial operating range: Rated for 0 °C to 85 °C to meet typical commercial environment requirements and system thermal plans.
• Regulatory readiness: RoHS compliance supports regulatory and supply‑chain requirements for lead‑free manufacturing.

Why Choose 5SGXEB5R2F43C1G?

The 5SGXEB5R2F43C1G targets designs that require a combination of very large logic capacity, significant embedded memory, and high I/O density in a single FPGA package. Its specification set supports consolidation of complex subsystems onto a single device and simplifies board routing with a high‑pin FCBGA package.

This part is suited for commercial applications where on‑chip resources, compact packaging, and predictable operating conditions are primary selection criteria. The device offers a balance of performance and integration for engineers building compute‑intensive, I/O‑heavy systems.

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