5SGXEB5R2F40I3LN

IC FPGA 432 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40)

Quantity 718 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-FBGA (40x40)Number of I/O432Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R2F40I3LN – Stratix® V GX FPGA IC, 432 I/O, 490,000 logic elements

The 5SGXEB5R2F40I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) IC designed for high-density logic and memory integration in industrial applications. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to support complex digital systems.

Packaged in a 1517-FBGA (40×40) surface-mount package and rated for industrial temperature operation, this device targets designs that require high logic capacity, significant embedded memory, and abundant I/O resources within a compact footprint.

Key Features

  • Core density — Approximately 490,000 logic elements and approximately 185,000 logic blocks provide extensive programmable logic capacity for complex designs.
  • Embedded memory — Approximately 42 Mbits of on-chip RAM (41,984,000 bits) for buffering, packet storage, and algorithmic state retention without external memory.
  • I/O resources — 432 user I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
  • Package and mounting — 1517-FBGA (40×40) supplier device package, surface-mount for compact system integration.
  • Power supply — Core voltage supply range 820 mV to 880 mV, enabling defined power-domain planning for system design.
  • Industrial temperature grade — Rated to operate from −40 °C to 100 °C for reliability in industrial environments.
  • Standards compliance — RoHS compliant, supporting regulatory and environmental requirements.

Typical Applications

  • Industrial control systems — Use the device’s high logic density and industrial temperature rating for programmable motor control, automation controllers, and real-time processing.
  • Network and communications — Leverage large embedded RAM and abundant I/O for packet buffering, protocol processing, and interface aggregation.
  • High-performance digital processing — Implement signal processing pipelines and custom accelerators that require wide logic fabric and on-chip memory.

Unique Advantages

  • High logic and memory integration: Combines approximately 490,000 logic elements with ~42 Mbits of embedded RAM to minimize reliance on external memory and reduce component count.
  • Dense I/O in a compact package: 432 user I/Os in a 1517-FBGA (40×40) footprint enable complex board designs without enlarging PCB area.
  • Industrial-ready thermal range: Rated from −40 °C to 100 °C to meet the demands of industrial installations and elevated ambient conditions.
  • Controlled core voltage range: Defined 820 mV to 880 mV supply window supports predictable power budgeting and domain planning.
  • Environmental compliance: RoHS compliance simplifies design for regulated markets and helps meet environmental directives.

Why Choose 5SGXEB5R2F40I3LN?

The 5SGXEB5R2F40I3LN positions itself as a high-capacity Stratix V GX FPGA suitable for industrial applications that demand substantial logic resources, on-chip memory, and a large number of I/Os in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for deployments where environmental robustness and regulatory conformance matter.

Engineers and system designers seeking a scalable, reliable FPGA platform will find the device’s combination of logic density, embedded RAM, and I/O count valuable for reducing external components and simplifying board-level architecture while maintaining clear power and thermal parameters.

Request a quote or submit your project requirements to receive pricing and availability information for the 5SGXEB5R2F40I3LN.

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