5SGXEB5R2F40I3LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 41984000 490000 1517-FBGA (40x40) |
|---|---|
| Quantity | 718 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-FBGA (40x40) | Number of I/O | 432 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R2F40I3LN – Stratix® V GX FPGA IC, 432 I/O, 490,000 logic elements
The 5SGXEB5R2F40I3LN is an Intel Stratix® V GX field programmable gate array (FPGA) IC designed for high-density logic and memory integration in industrial applications. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to support complex digital systems.
Packaged in a 1517-FBGA (40×40) surface-mount package and rated for industrial temperature operation, this device targets designs that require high logic capacity, significant embedded memory, and abundant I/O resources within a compact footprint.
Key Features
- Core density — Approximately 490,000 logic elements and approximately 185,000 logic blocks provide extensive programmable logic capacity for complex designs.
- Embedded memory — Approximately 42 Mbits of on-chip RAM (41,984,000 bits) for buffering, packet storage, and algorithmic state retention without external memory.
- I/O resources — 432 user I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
- Package and mounting — 1517-FBGA (40×40) supplier device package, surface-mount for compact system integration.
- Power supply — Core voltage supply range 820 mV to 880 mV, enabling defined power-domain planning for system design.
- Industrial temperature grade — Rated to operate from −40 °C to 100 °C for reliability in industrial environments.
- Standards compliance — RoHS compliant, supporting regulatory and environmental requirements.
Typical Applications
- Industrial control systems — Use the device’s high logic density and industrial temperature rating for programmable motor control, automation controllers, and real-time processing.
- Network and communications — Leverage large embedded RAM and abundant I/O for packet buffering, protocol processing, and interface aggregation.
- High-performance digital processing — Implement signal processing pipelines and custom accelerators that require wide logic fabric and on-chip memory.
Unique Advantages
- High logic and memory integration: Combines approximately 490,000 logic elements with ~42 Mbits of embedded RAM to minimize reliance on external memory and reduce component count.
- Dense I/O in a compact package: 432 user I/Os in a 1517-FBGA (40×40) footprint enable complex board designs without enlarging PCB area.
- Industrial-ready thermal range: Rated from −40 °C to 100 °C to meet the demands of industrial installations and elevated ambient conditions.
- Controlled core voltage range: Defined 820 mV to 880 mV supply window supports predictable power budgeting and domain planning.
- Environmental compliance: RoHS compliance simplifies design for regulated markets and helps meet environmental directives.
Why Choose 5SGXEB5R2F40I3LN?
The 5SGXEB5R2F40I3LN positions itself as a high-capacity Stratix V GX FPGA suitable for industrial applications that demand substantial logic resources, on-chip memory, and a large number of I/Os in a compact FBGA package. Its industrial temperature rating and RoHS compliance make it a practical choice for deployments where environmental robustness and regulatory conformance matter.
Engineers and system designers seeking a scalable, reliable FPGA platform will find the device’s combination of logic density, embedded RAM, and I/O count valuable for reducing external components and simplifying board-level architecture while maintaining clear power and thermal parameters.
Request a quote or submit your project requirements to receive pricing and availability information for the 5SGXEB5R2F40I3LN.

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