5SGXEB5R2F40I3G

The 5SGXEB5R2F40I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It combines very high logic density with substantial on‑chip RAM and a large I/O count, packaged in a 1517‑FBGA (40×40) surface‑mount package.

This device is targeted at designs that require dense programmable logic, significant embedded memory, and extensive I/O connectivity within an industrial temperature range and a low core-voltage operating window.

Key Features

• Logic density Approximately 490,000 logic elements to implement complex, high‑capacity digital designs.
• Embedded memory Approximately 42 Mbits of on‑chip RAM for large buffering, state storage, and on‑device data processing.
• I/O capacity 432 available I/O pins to support multi‑channel interfacing and broad peripheral connectivity.
• Transceiver capability (series data) Stratix V GX family transceiver speed grades are documented in the device series datasheet (GX channel speed grades include options up to 14.1 Gbps), enabling high‑speed serial connectivity where applicable to the family.
• Power supply Core voltage supply range specified at 820 mV to 880 mV for the device core.
• Package & mounting 1517‑FBGA (40×40) supplier device package with surface‑mount mounting suitable for compact board implementations.
• Industrial temperature grade Rated for operation from –40 °C to 100 °C for use in temperature‑demanding environments.
• Compliance RoHS‑compliant manufacturing.

Typical Applications

• High‑density digital processing Implement large custom logic and data‑path designs using the device’s nearly 490k logic elements and substantial embedded RAM.
• Multi‑channel interface hubs Use the 432 I/O pins to consolidate and bridge multiple parallel and serial interfaces on a single FPGA platform.
• Industrial control and automation The industrial temperature rating (–40 °C to 100 °C) and high logic density make this device suitable for complex control, monitoring, and embedded processing in industrial equipment.
• On‑device buffering and memory‑intensive processing Approximately 42 Mbits of embedded RAM support large buffers, FIFOs, and scratch memory for real‑time data handling.

Unique Advantages

• High programmable capacity: Approximately 490,000 logic elements provide the headroom to consolidate multiple functions and reduce external ASIC or discrete logic requirements.
• Significant embedded memory: Approximately 42 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and processing tasks, simplifying board design.
• Large I/O complement: 432 I/O pins enable dense connectivity for multi‑lane interfaces, I/O expansion, or aggregating peripheral signals without additional bridging hardware.
• Industrial temperature support: Rated from –40 °C to 100 °C, allowing deployment in thermally challenging environments common in industrial systems.
• Compact, surface‑mount FBGA package: The 1517‑FBGA (40×40) package balances high pin count with a compact board footprint for space‑constrained designs.
• Controlled core voltage range: Specified 820 mV to 880 mV core supply range supports predictable power planning for system designers.

Why Choose 5SGXEB5R2F40I3G?

The 5SGXEB5R2F40I3G combines high logic density, substantial embedded RAM, and a large I/O complement in an industrial‑rated Stratix V GX FPGA. Its combination of approximately 490,000 logic elements and roughly 42 Mbits of on‑chip memory supports complex, memory‑intensive designs while minimizing external component count.

This device is well suited to engineers and procurement teams building compact, high‑capability systems requiring broad connectivity and reliable operation across a wide temperature range. Its FBGA package and surface‑mount mounting enable dense board layouts while the documented family transceiver capabilities provide options for high‑speed serial interfaces as defined in the Stratix V GX series documentation.

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