5SGXEB5R2F40I3N

The 5SGXEB5R2F40I3N is an industrial‑grade Stratix® V GX field programmable gate array in a 1517‑FBGA (40×40) package. It delivers very high logic density and substantial on‑chip memory for complex digital designs that require large routing and I/O capacity.

With 490,000 logic elements, approximately 42 Mbits of embedded memory and 432 I/O pins, this surface‑mount FPGA is aimed at applications demanding high integration, extensive I/O connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity  490,000 logic elements to implement large-scale digital designs and complex custom hardware accelerators.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support buffering, lookup tables and local data storage.
• I/O  432 general‑purpose I/O pins to interface with high‑pin‑count peripherals, external devices and multi‑lane connectivity.
• Power Supply  Operating voltage range of 820 mV to 880 mV, providing the specified core supply requirement for the device.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact board integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to meet challenging thermal environments.
• Compliance  RoHS‑compliant construction to support regulatory and environmental requirements.

Typical Applications

• High‑density digital logic  Use the 490,000 logic elements to implement large ASIC replacements, packet processing or protocol engines on a single FPGA.
• Memory‑intensive designs  Approximately 42 Mbits of embedded RAM supports frame buffers, FIFO chains and on‑chip caches for data‑streaming applications.
• Multi‑lane I/O and bridging  432 I/O pins enable complex interface aggregation, protocol bridging and high‑pin‑count peripheral control.
• Industrial control and monitoring  Industrial temperature rating and robust package make it suitable for control systems and factory automation equipment.

Unique Advantages

• Very high logic density: 490,000 logic elements let you consolidate multiple functions into a single device, reducing BOM and board area.
• Substantial on‑chip memory: Approximately 42 Mbits of embedded RAM minimizes dependency on external memory for many buffering and algorithmic needs.
• Extensive I/O capability: 432 I/O pins provide flexible connectivity options for multi‑lane interfaces and parallel data paths.
• Industrial robustness: Rated for −40 °C to 100 °C operation to withstand demanding environments and extended temperature cycles.
• Compact FBGA package: 1517‑FBGA (40×40) surface‑mount package supports dense board layouts while maintaining solderable, production‑ready form factor.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing and procurement requirements.

Why Choose 5SGXEB5R2F40I3N?

The 5SGXEB5R2F40I3N positions itself as a high‑density, industrial‑grade FPGA suitable for designs that require a balance of large logic capacity, significant embedded memory and broad I/O. Its combination of 490,000 logic elements, approximately 42 Mbits of on‑chip RAM and 432 I/O pins makes it a strong candidate for complex protocol processing, data‑plane acceleration and control logic consolidation in industrial systems.

Designed for production environments, the device’s surface‑mount 1517‑FBGA package and RoHS compliance facilitate integration into modern PCBs while the −40 °C to 100 °C rating supports deployment in thermally challenging installations. This part is appropriate for engineering teams seeking a scalable, high‑capacity FPGA foundation for long‑lifecycle projects.

Request a quote or submit a pricing inquiry to receive availability and lead‑time information for part number 5SGXEB5R2F40I3N.